Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

There is provided an epoxy composition which has difficulty in precipitating a crystal during storage, is homogeneous and can be stored for a long period; and a cured product of the composition having excellent transparency, heat resistance, and light resistance can be obtained on curing. An α-type tris-(2,3-epoxypropyl)-isocyanurate crystal including β-type tris-(2,3-epoxypropyl)-isocyanurate in the crystal in a ratio of 2% by mass to 15% by mass. A method for producing the α-type tris-(2,3-epoxypropyl)-isocyanurate crystal including step (i) separating β-type tris-(2,3-epoxypropyl)-isocyanurate contained in a tris-(2,3-epoxypropyl)-isocyanurate solution from the solution as a solid to obtain a crystal with an increased content ratio of α-type tris-(2,3-epoxypropyl)-isocyanurate.

A curable resin composition includes (A) a specific curable resin and (C) a curing agent, and further includes (BI) 0.1 parts by mass or more and 20 parts by mass or less of a polyhydric alcohol having 2 to 5 hydroxyl groups, based on based on 100 parts by mass of the curable resin (A); (BII) a cyclic compound having 3 to 6 reactive groups and a reactive group equivalent of 100 g/eq or more and 300 g/eq or less; or (BIII) a specific oxetane compound in a mass ratio of the curable resin (A) to the oxetane compound (BIII) being 5:5 to 9:1.

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

The present disclosure is generally directed to a method of curing an ionic liquid epoxy mixture using an electromagnetic signal. First, an ionic liquid epoxy resin comprising ionic liquid epoxide monomers and, optionally, diluent epoxy resins and powdered fillers, is combined with a curing agent to form an ionic liquid epoxy mixture. The mixture is then applied as a coating onto a surface of a material. The coating is placed in contact with a second surface of the same material or a surface of another material. An electromagnetic signal, which in some instances is a microwave signal, is applied to the coating. Following application of the signal, the ionic liquid epoxide monomers polymerize and the mixture cures, adhering the surfaces together. Alternately, the epoxy mixture is applied to a surface and cured with microwaves to form a protective coating as in cladding or paint.

A curable composition which is capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, and has satisfactory curability, a cured film obtained from a cured product of the curable composition, a display panel or an OLED light provided with the cured film, and a method for producing a cured product using the curable composition. The composition includes a curable compound and a cationic polymerization initiator, and contains a cationic polymerizable compound having, as the main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and a salt including a gallium-containing anion as the cationic polymerization initiator.

The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, wherein the epoxy resin composition meets certain sets of further requirements with respect to its composition.

A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent: ##STR00001##
(wherein R.sub.1 is a C.sub.1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)

A resist underlayer film having a particularly high dry etching rate; a resist underlayer film-forming composition; a resist pattern forming method; and a semiconductor device production method. The resist underlayer film-forming composition contains a solvent and an epoxy adduct obtained by reacting a compound represented by formula (1) and an epoxy adduct-forming compound. The epoxy adduct-forming compound is one or more compounds selected from the group made of carboxylic acid-containing compounds, carboxylic anhydride-containing compounds, hydroxy group-containing compounds, thiol group-containing compounds, amino group-containing compounds, and imide group-containing compounds.

An epoxy resin composition in a liquid or solid state having excellent solubility and having high preservation stability. A modified epoxy resin composition including: Compound A containing tris-(2,3-epoxypropyl)-isocyanurate having 1 to 3 glycidyl group(s) in a molecule substituted with a functional group(s) of Formula (1): ##STR00001##
in which R.sup.1 and R.sup.2 are each independently an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group; or a halogenated derivative, an aminated derivative, or a nitrated derivative of these groups; and Compound B containing tris-(2,3-epoxypropyl)-isocyanurate, wherein tris-(2,3-epoxypropyl)-isocyanurate of Compound A before the substitution and tris-(2,3-epoxypropyl)-isocyanurate of Compound B comprise 2% by mass to 15% by mass of -type tris-(2,3-epoxypropyl)-isocyanurate and a remaining percentage of -type tris-(2,3-epoxypropyl)-isocyanurate based on a total mass of Compound A before the substitution and Compound B.