The invention relates to a hydrogel based on water, on hydrosoluble monomeric or polymeric isosorbide epoxide and on hydrosoluble amine, to the method for preparing same and to the use thereof.

The present invention relates novel furan based amine cross-linkers with improved thermomechanical and water barrier properties. The novelty of this invention is the use of aromatic, and hydrophobic aliphatic aldehydes to bridge two furfuryl amines, which yields a diamine or tetra amines with a significantly enhanced hydrophobic character. These diamine cross-linkers exhibit enhanced water barrier properties and thermomechanical properties when cured with both commercial and synthetic epoxies.

A fluorine-containing ether compound of the present invention is represented by the following General Formula (1). (In the General Formula (1), X is a trivalent atom or a trivalent atom group, A is a linking group including at least one polar group, B is a linking group having a perfluoropolyether chain, and D is a polar group or a substituent having a polar group at the end.)
[Chem. 1]
XA-B-D).sub.3  (1)

Fatty acid polyester derivatives of polyglycosides formed from a polyol having between 2 and 10 hydroxy functions, the 2 hydroxy functions or at least 2 of these hydroxy functions being bound to the anomeric carbon of a reducing carbohydrate that is identical or different for each hydroxy group and selected from the monosaccharides and disaccharides, in which at least one of the other hydroxy groups of the monosaccharide or the disaccharide is esterified by a lipid derivative bearing at least one double bond optionally originating from a vegetable or animal oil, from a mixture of vegetable or animal oils, the double bond or the at least one of the double bonds of the lipid derivative being functionalized by a group selected from the epoxy, amine, alcohol and acid groups, and use thereof in particular in reaction formulations for the production of polymer materials.

An object of the present invention is to provide a composition for forming a thermally conductive material, from which a thermally conductive material having excellent thermally conductive properties and adhesiveness can be obtained. In addition, another object of the present invention is to provide a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer. A composition for forming a thermally conductive material of the present invention contains a thermosetting compound A, boron nitride particles B containing boron nitride and having an average particle diameter of 25.0 μm or more, and boron nitride particles C containing boron nitride and having an average particle diameter of 15.0 μm or less, in which an oxygen atom concentration on a surface of the boron nitride particles C detected by X-ray photoelectron spectroscopic analysis is 1.5 atomic % or more.

The invention relates to a curable coating composition comprising at least one glycidyl carbamate (GC) resin, at least one amphiphilic GC-functional prepolymer, and at least one curing agent. The invention also relates to a method of making the curable coating compositions. The invention also relates to an article of manufacture comprising the curable coating composition of the invention and a method of making such article. The invention also relates to a fouling-release (FR) coating system and an anti-coating system, each of which comprises the curable coating compositions of the invention, methods of applying the FR coating systems and anti-coating systems to substrates, and methods for reducing or preventing biofouling or icing of a surface exposed to an aqueous environment using the FR coating systems.

A curable composition which is capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, and has satisfactory curability, a cured film obtained from a cured product of the curable composition, a display panel or an OLED light provided with the cured film, and a method for producing a cured product using the curable composition. The composition includes a curable compound and a cationic polymerization initiator, and contains a cationic polymerizable compound having, as the main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and a salt including a gallium-containing anion as the cationic polymerization initiator.

The present invention provides a thermally conductive material-forming composition from which a thermally conductive material having excellent thermally conductive properties can be obtained. Moreover, a thermally conductive material formed of the thermally conductive material-forming composition, a thermally conductive sheet, and a device with a thermally conductive layer are provided. Further, the present invention provides a film from which a thermally conductive sheet having excellent thermally conductive properties can be prepared. Furthermore, a thermally conductive sheet prepared using the film, and a device with a thermally conductive layer are provided. The thermally conductive material-forming composition according to the embodiment of the present invention is a thermally conductive material-forming composition including an epoxy compound, one or more kinds of phenolic compounds selected from the group consisting of a compound represented by General Formula (1) and a compound represented by General Formula (2), and an inorganic substance, or the like.

##STR00001##

The present invention is a negative-acting photosensitive resin composition including (A) a compound having a triazine ring and represented by formula (1) (in formula (1), each R.sub.1 independently represents an organic group, wherein at least one R.sub.1 represents an organic group having a glycidyl group or an organic group having an oxetanyl group), (B) an epoxy resin having in each molecule a benzene backbone and at least two epoxy groups and having an epoxy equivalent weight of not more than 500 g/eq., and (C) a cationic photopolymerization initiator. The content of the (A) compound represented by formula (1) with reference to the (B) epoxy resin is 1 to 50 mass %. The (B) epoxy resin satisfies at least one of the following conditions (i) and (ii): condition (i) a weight-average molecular weight of at least 500, and condition (ii) a softening point of at least 40° C.

##STR00001##

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), ##STR00001##
(wherein X is a C.sub.1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C.sub.1-16 hydrocarbon group, Z is a divalent C.sub.1-4 linking group, the divalent linking group being bonded to an O group in formula (1), and R.sup.1 is a hydrogen atom or a methyl group.)