Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer having two or three epoxy groups, which is not a silicon compound having at least one hydrolyzable group directly linked to the silicon atom, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one group comprising an epoxy function linked to the silicon atom though a carbon atom, and/or a hydrolyzate thereof, at least one epoxy ring-opening catalyst, and at least one compound comprising at least two (2,2,6,6-tetramethyl-4-piperidyl)-groups in which the nitrogen atom can be substituted with an alkyl group, an alkoxy group or an oxyl group.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer having two or three epoxy groups, which is not a silicon compound having at least one hydrolyzable group directly linked to the silicon atom, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one group comprising an epoxy function linked to the silicon atom though a carbon atom, and/or a hydrolyzate thereof, at least one epoxy ring-opening catalyst, and at least one compound comprising at least two (2,2,6,6-tetramethyl-4-piperidyl)-groups in which the nitrogen atom can be substituted with an alkyl group, an alkoxy group or an oxyl group.

The present invention relates to an optical filtering coating composition, comprising at least one dye that at least partially inhibits transmission of light within the 400-500 nm wavelength range and has a conjugated chromophore, one or more epoxy compounds comprising at least one cycloaliphatic or aryl group, the ratio of the number of carbon atoms/the number of oxygen atoms in said epoxy compound being higher than or equal to 3, and the dry extract weight of such epoxy compounds present in the composition representing more than 33% of the dry extract weight of the composition. The coating composition can be applied on the main surface of the substrate of an optical article.

A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A of formula (II) ##STR00001##
wherein substituents R′ and R″ independently of one another are H or CH.sub.3 and index s has value of 0-12, fraction of epoxy resin A being from 20-70 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive; and b) at least one epoxy novolac EN of formula ##STR00002##
where R2= ##STR00003##
or CH.sub.2, R1=H or methyl and z=0-7, fraction of epoxy novolac EN being from 1-8 wt.-% based on total weight of one-component thermosetting epoxy resin adhesive; and c) at least one latent hardener B for epoxy resins; and d) at least one accelerator C for epoxy resins; and e) at least at least one toughness improver D, fraction of toughness improver D being from 5-40 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive.

The present invention relates to an epoxy composition comprising a) a cycloaliphatic epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure I:

##STR00001##

The composition according to the present invention can be used as a structural adhesive, a coating and a primer.

The present invention relates to an epoxy composition comprising a) a cycloaliphatic epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure I:

##STR00001##

The composition according to the present invention can be used as a structural adhesive, a coating and a primer.

The present invention relates to an epoxy composition comprising a) an epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure I:

##STR00001##

The composition according to the present invention can be used as a structural adhesive, a coating and a primer.

Sealers, construction products, and methods of sealing construction products are provided. In an exemplary embodiment, a sealer includes a first part and a second part, the first part includes an epoxy resin having an epoxy resin molecular weight of about 5,000 Daltons or greater, and also includes an epoxy functional diluent having a diluent molecular weight of about 2,000 Daltons or less. The second part includes a crosslinking agent that is a polyamine. The sealer further includes a particulate with a specific gravity of from about 1 to about 5 grams per cubic centimeter.