A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.

A resinous polymer compound used as a durable surface coating that maximizes content of epoxidized soybean oil (“ESO”) in lieu of bisphenol-A epoxy and hydrogenated bisphenol-A epoxy at various proportions to produce a less brittle, more elastic (flexible) film that, at various weight-percentages of substitution, presents a rapid enough reaction rate for efficient commercial production and yields a colorless and transparent film while lessening the amount of synthetic, petroleum-derived ingredients.

The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.

A curable coating composition precursor comprising a first part (A) and a second part (B). The first part (A) comprises at least one first epoxy curing agent selected from aliphatic and cycloaliphatic amines and any combinations and mixtures thereof. The second part (B) comprises at least epoxy compound selected from bisphenol A and bisphenol F diglycidylether resins, and any combinations and mixtures thereof; at least one polyfunctional epoxy resin; at least one novolac epoxy resin; and optionally, at least one reactive diluent, Part (A) and/or part (B) comprise at least one inorganic phosphate compound.

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.