Patent classifications
C08G59/4028
Cured composition having high impact strength and temperature resistance, based on an epoxy resin and a polyisocyanate
The invention relates to a method for producing a cured composition which has at least one oxazolidinone ring and at least one isocyanurate ring and is cross-linked by the same, starting from a liquid reactive mixture which, based on the total weight thereof, contains at least one epoxy resin, at least one polyisocyanate, at least one polyol, and at least one catalyst composition. The invention further relates to the cured composition obtainable thereby.
MOLDING MATERIAL AND FIBER REINFORCED COMPOSITE MATERIAL
The purpose of the present invention is to provide: a molding material from which a carbon fiber reinforced composite material having excellent impact resistance and tensile strength is obtained; and a molding material from which a glass fiber reinforced composite material, that has high bending strength and impact resistance, has excellent weather resistance, and can suppress a decrease in bending strength after water absorption, is obtained. In order to achieve the purpose, the molding material according to the present invention is a molding material formed of an epoxy resin composition and a carbon fiber and/or a glass fiber, wherein the epoxy resin composition includes all of [A] to [C], the carbon fiber satisfies conditions [a] and [b], and the glass fiber has a surface functional group capable of forming a covalent bond with an isocyanate group. [A] Epoxy resin having at least two oxylan groups in molecule [B] Epoxy resin curing agent having at least two isocyanate groups in molecule [C] Catalyst [a] Having substantially perfect circular cross section [b] Average fiber diameter of 4.0-8.0 μm
Polyisocyanurate based polymers and fiber reinforced composites
A method of making an isocyanurate polymer is disclosed. An isocyanate including at least one of an aromatic isocyanate and an aliphatic isocyanate is provided. A trimerization catalyst including at least one of an amine catalyst, an organometallic compound, and an imidazole compound is provided. A reaction mixture that is substantially free of reactive hydrogen is formed by mixing less than about twenty percent by total weight of said reaction mixture of an epoxide with said isocyanate. The trimerization catalyst is mixed with the reaction mixture. The reaction mixture is cured to produce a polymer composition including a reaction product of two or more isocyanates.
METHOD FOR THE PRODUCTION OF A THERMOPLASTIC POLYOXAZOLIDINONE
A process for producing a thermoplastic polyoxazolidinone comprising copolymerizing a diisocyanate compound (A) with a bisepoxide compound (B) in the presence of a specific a quaternary ammonium, quaternary phoshonium and/or quaternary stibonium-based catalyst (C), a compound (D), a compound (F) wherein compound (D) and compound (F) independently comprises at least one of a monofunctional isocyanate, a monofunctional epoxide, a cyclic carbonate, a monofunctional alcohol, a monofunctional amine optionally in a solvent (E), and wherein the catalyst (C) is added in at least two portions (C-1) and (C-2). The invention is also related to the resulting thermoplastic polyoxazolidinone.
Nail sticker, composition for nail sticker and method for preparing composition
A nail sticker, a composition for the nail sticker and a method for preparing the composition are disclosed. Raw materials of the composition include a sizing material, which is made of the following raw materials in parts by weight: 45-85 parts of a UV thermosetting resin, 2-9 parts of a photoinitiator, 1.5-2 parts of a curing agent, 0.1-1 part of a thermal promoter, and 0.1-1 part of a leveling agent. The synchronization of the release of essential oil molecules with light/thermal curing promotes the essential oil molecules to be diffused to the interior of the sizing material more uniformly in a wider range, and during the curing and film forming of the nail sticker, an aroma spreads as tantalizing as that of baked food.
CATHODIC ELECTROCOATING COMPOSITION HAVING REDUCED VOLATILE ORGANIC COMPOUNDS
A cathodic electrocoating composition having reduced volatile organic compounds includes: an epoxy resin comprising; a film forming binder, and a cross-linking agent; a pigment paste; water; and about 0.01 to about 10 percent by weight of an oxo-alcohol, based on a total weight of the composition, wherein the resin composition is free of glycol ethers.
Accelerator composition for the cure of polyfunctional isocyanates with epoxy resins
The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.
ELECTROCOATING COMPOSITION
Aqueous cathodic electrocoating compositions, methods for preparing aqueous cathodic electrocoating compositions, and methods for electrodepositing coatings from aqueous cathodic electrocoating compositions are provided. An aqueous cathodic electrocoating composition having a binder resin and a crosslinking agent is provided. In the aqueous cathodic electrocoating composition, a bismuth-sugar solution is used to provide a catalytic amount of a bismuth compound dispersed in the electrocoating composition.
CURABLE COMPOSITIONS
The present invention is directed to a curable composition including: an isocyanate-functional prepolymer; an epoxy-containing component present in an amount of at least 10 percent by weight of the composition; and a latent curing agent having an ability to react with at least one of the isocyanate-functional prepolymer and the epoxy-containing component upon exposure to an external energy source. The present invention is also directed to methods of making the compositions, methods of coating a substrate, methods of adhering substrates and coated substrates.
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ.sub.200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m.Math.K) or higher. In addition, a volume resistivity R.sub.200 of the cured product at 200° C. is preferably 1.0×10.sup.10 Ω.Math.m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.