A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm.sup.2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm.sup.2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.

The present invention provides a UV curable composition, a UV curable adhesive film and a UV curable adhesive tape. The UV curable composition comprises, based on the total weight thereof as 100 wt %: 25 to 60 wt % of an ethylene-vinyl acetate copolymer; 20 to 60 wt % of an epoxy resin; 5 to 20 wt % of glass bubbles; 0.3 to 8 wt % of a hydroxy-containing compound; and 0.5 to 5 wt % of a photoinitiator. According to the technical solution of the present invention, cohesive failure can be achieved in the cured adhesive film by the addition of glass bubbles into the UV curable system. The UV curable product provided in the present invention can achieve a good balance among the initial adhesivity, structural strength after curing, odorlessness or low odor, and other performance.

The present disclosure provides a curable resin composition including a thermoset resin, an aliphatic polyketone as a toughener and a hardener. The curable resin composition may be combined with reinforcing fibers and then cured to form a fiber-reinforced composite article having a high glass transition temperature, excellent mechanical properties and low moisture absorption. The fiber-reinforced composite article may be used in various applications, such as in transport applications including aerospace, aeronautical, nautical and land vehicles.

In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.

The purpose of the present invention is to provide: an epoxy resin composition which enables the achievement of a resin cured product that has high flame retardancy and excellent mechanical characteristics; and a prepreg and a fiber-reinforced composite material, each of which uses this epoxy resin composition. One embodiment of the epoxy resin composition according to the present invention, said epoxy resin composition having achieved the above-described purpose, contains the components (A) and (B) described below. (A): a bifunctional glycidyl amine type epoxy compound (B): an epoxy compound having a specific structure and/or an epoxy compound having another specific structure

A curing agent composition based on diaminomethylcyclohexane and 1,3-cyclohexanebis(methylamine) can be used in an epoxy resin composition for chemical fastening of structural elements. A corresponding epoxy resin composition and multi-component epoxy resin system can contain the curing agent composition. A method can be used for chemical fastening of structural elements in boreholes with the epoxy resin composition or the multi-component epoxy resin system.

A method for producing a shaped object, the method comprising: laminating a photosensitive resin composition on an inorganic material layer of a substrate having the inorganic material layer on a surface thereof; performing a patterned exposure of the photosensitive resin composition using an i-line; and curing a pattern-exposed portion and removing an unexposed portion to form a shaped object in which a cured product of the photosensitive resin composition is formed on the substrate, wherein the photosensitive resin composition comprises an epoxy resin, at least one cationic polymerization initiator with a molar extinction coefficient in an i-line of less than 500 L.Math.mol.sup.−1.Math.cm.sup.−1 and at least one sensitizer with a molar extinction coefficient in an i-line of 500 L.Math.mol.sup.−1.Math.cm.sup.−1 or more.

An ionic aqueous epoxy curing agent, a preparation method therefor and the use thereof. The aqueous epoxy curing agent is prepared by reacting the following raw materials in parts by weight: a) 1 part of a polyepoxy compound, b) 1.3-6 parts of a multifunctional compound, c) 0.2 to 1.25 parts of a monoepoxy compound, and d) 0.01 to 0.23 parts of a sultone, wherein the multifunctional compound has four or more active hydrogens. The curing agent obtained has a good hydrophilic effect and very good thinning performance, the paint film prepared by mixing same with an epoxy dispersion has the following advantages: excellent salt spray resistance and water resistance, strong adhesion, high hardness, etc.; in addition, the preparation process of the curing agent is simple, the conditions are mild, and room temperature curing is carried out.

Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.