A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, $\frac{\sigma D\times \sigma H}{\sigma D+\sigma H}\le 1.0,$
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.

The invention relates to a potting paste composition for honeycomb reinforcement having improved fire retardancy characteristics. The potting paste composition comprises (a) a curable polymer; (b) a curing agent for the curable polymer; (c) a fire retardant comprising an ammonium polyphosphate in combination with an ingredient selected from the group consisting of metal hydroxides, expandable graphites, liquid phosphate esters, phosphorous organic compounds or salts thereof, and zeolites; and(d) a filler selected from the group consisting of polymeric microspheres, hollow glass microspheres, and thixotropic fillers; wherein the potting paste has an uncured density determined by the method according to EN ISO 1183 of not more than 0.7100 g/cm.sup.3, preferably of at most 0.680 g/cm.sup.3, more preferably of at most 0.673 g/cm.sup.3, still more preferably of at most 0.660 g/cm.sup.3, even more preferably of at most 0.658 g/cm.sup.3, yet more preferably of at most 0.653 g/cm.sup.3 and in particular of at most 0.620 g/cm.sup.3; and wherein the total content of the fire retardant is at least 5.0 wt.-%, preferably at least 10 wt.-%, more preferably at least 15 wt.-%, relative to the total weight of the potting paste composition.

The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.

A method for producing a shaped object, the method comprising: laminating a photosensitive resin composition on an inorganic material layer of a substrate having the inorganic material layer on a surface thereof; performing a patterned exposure of the photosensitive resin composition using an i-line; and curing a pattern-exposed portion and removing an unexposed portion to form a shaped object in which a cured product of the photosensitive resin composition is formed on the substrate, wherein the photosensitive resin composition comprises an epoxy resin, at least one cationic polymerization initiator with a molar extinction coefficient in an i-line of less than 500 L.Math.mol.sup.−1.Math.cm.sup.−1 and at least one sensitizer with a molar extinction coefficient in an i-line of 500 L.Math.mol.sup.−1.Math.cm.sup.−1 or more.

An adhesive for an endoscope, the adhesive including (A) an epoxy resin including at least one epoxy resin of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, (B) a curing component including at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenol compound, or a polyether-polyamine compound, and (C) an inorganic amphoteric ion exchanger; and a cured product of the adhesive. An endoscope including the cured product fixed, and a method for producing the endoscope.

The present invention relates to compositions (self-thermally) curable on demand under the triggering action of UV-visible to near-infrared irradiation of moderate intensity, method of using same for accelerated photopolyaddition of cyclic ether-anhydride resins or dark curing of cyclic ether-anhydride resins, and articles obtained by such method. The invention also relates to a resin casting, film or coated substrate, and an adhesive layer or bonding agent, comprising a cyclic ether-anhydride resin obtained by an accelerated curing process according to the invention. The invention additionally relates to the use of a composition of the invention for increasing the delamination strength of laminated composite materials.

Disclosed is an environment-friendly and flame-retardant abradable seal coating material with an ultra-low density and a use method thereof. The seal coating material includes a component A and a component B packaged separately; the component A includes 20-30 wt % of a curing agent for bisphenol A epoxy resin, 20-30 wt % of a liquid phosphorus-containing curing agent, 20-40 wt % of a hollow glass microbead, 1-5 wt % of 2,4,6-tris(dimethylaminomethyl)phenol, 5-15 wt % of dimethyl methylphosphonate and 0.5-3 wt % of a silane coupling agent; the component B includes 30-40 wt % of a bisphenol A epoxy resin, 30-40 wt % of a liquid phosphorus-containing epoxy resin, 20-30 wt % of a hollow glass microbead, 0-10 wt % of a liquid acrylonitrile-butadiene rubber and 0.5-3 wt % of a silane coupling agent. The method includes: mixing the component A and the component B to obtain a coating, and applying the obtained coating to a surface of a part for curing.

The host compound in a clathrate is an amino or hydroxyl containing aromatic phosphorous compound, clathrates containing a resin curative and their use in curable resin compositions to produce moulded articles particularly fibre reinforced articles.

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.