The present invention is directed to a liquid one component (1 K) composition comprising, based on the weight of the composition: from 10 to 90 wt.% of a) at least one epoxy resin; from 0.5 to 30 wt.% of b) at least one organoboron compound selected from tetrasubstituted borate salts of monovalent cations of tertiary amines; from 10 to 50 wt.% of c) at least one (meth)acrylamide monomer of Formula (VII): [00001] wherein: R.sup.a is H or Me; G is selected from —NH.sub.2, —NHR.sup.b and —N(R.sup.b)(R.sup.c); R.sup.b and R.sup.care independently selected from C.sub.1-C.sub.18 alkyl, C.sub.1-C.sub.18 hydroxyalkyl, C.sub.1-C.sub.18 alkalkoxy, C.sub.6-C.sub.18 aryl and —(CH.sub.2).sub.n —N(R.sup.d)(R.sup.e); n is an integer of from 1 to 4; and, R.sup.d and R.sup.e are independently selected from H and C.sub.1-C.sub.6 alkyl; and, from 0.05 to 10 wt.% of d) at least one free radical photoinitiator.

The purpose of the present invention is to provide an epoxy resin composition which exhibits a high level of deforming capacity and fracture toughness and from which a resin cured product maintaining heat resistance can be obtained. The epoxy resin composition according to the present invention satisfies condition 1 or condition 2 below, wherein the resin cured product obtained by reacting the epoxy resin composition at 150° C. for 60 minutes has a tensile elongation at break of 7% or more. Condition 1: including all the following components [A], [B], and [C], component [A]: a bifunctional aliphatic epoxy resin having a specific structure, component [B]: a terminal carboxy-modified acrylic rubber, and component [C]: a dicyandiamide. Condition 2: including the following components [D], [E], and [F] and satisfying conditions [a] and [b] below, component [D]: core-shell type rubber particles, component [E]: a boric ester compound, component [F]: a curing agent, condition [a]: including 9-18 parts by mass of component [D] with respect to 100 parts by mass of the total epoxy resin, and condition [b]: 0.003≤(the content of component [E]/the content of component [D])≤0.05.

The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014≤(content of component [D]/content of component [C])≤0.045, [b]: 0.9≤(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])≤1.2, and [c]: 14≤(content of component [A]/content of component [C])≤25.

There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particularly carbonate) at a low temperature. The conductive adhesive according to the present invention is a conductive adhesive which contains the following components (A) to (C) and is liquid at 25° C.: component (A): an alicyclic epoxy resin; component (B): a boron-based thermal cationic initiator; and component (C): a conductive filler.

The invention relates to an impregnation resin mixture and to the use thereof. In one embodiment, an impregnation resin mixture includes a) at least one epoxide resin component selected from the group consisting of polyepoxides based on bisphenol A and/or F, and advancement resin produced therefrom, based on epoxidized halogenated bisphenols and/or epoxidized novolaks and/or polyepoxide esters based on phthalic acid, hexahydrophthalic acid, or based on terephthalic acid, epoxidized polyaddition products from dicyclopentadiene and phenol or cycloaliphatic compounds, b) as reactive diluents, 2 to 30 wt. % lactones with respect to the sum of the epoxy resin components, c) BCI3 and/or BCI3 complexes and/or a compound selected from the group of imidazoles and d) optionally additional additives, wherein the impregnation resin mixture does not contain any carboxylic acid anhydrides.

A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.

A curable composition which is capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, and has satisfactory curability, a cured film obtained from a cured product of the curable composition, a display panel or an OLED light provided with the cured film, and a method for producing a cured product using the curable composition. The composition includes a curable compound and a cationic polymerization initiator, and contains a cationic polymerizable compound having, as the main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and a salt including a gallium-containing anion as the cationic polymerization initiator.

A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.

The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt. % of a) at least one oxetane compound according to Formula (1) below:

##STR00001## wherein: R.sup.1 and R.sup.2 are H, C.sub.1-C.sub.6 alkyl, C.sub.6-C.sub.18 aryl or C.sub.7-C.sub.18 aralkyl; each R.sup.3 is independently a C.sub.1-C.sub.12 alkylene group, C.sub.6-C.sub.18 arylene group, C.sub.2-C.sub.12 alkenylene group or a poly(C.sub.1-C.sub.6 alkyleneoxy) group; and, n is an integer of from 1 to 3; from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt % of c) at least one ionic photoacid generator; from 0 to 10 wt. % of d) at least one free radical photoinitiator; from 0.01 to 5 wt. % of e) at least one near-infrared absorbing dye; and, from 50 to 90 wt. % of f) particulate filler.

There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particularly carbonate) at a low temperature.

The conductive adhesive according to the present invention is a conductive adhesive which contains the following components (A) to (C) and is liquid at 25 C.: component (A): an alicyclic epoxy resin; component (B): a boron-based thermal cationic initiator; and component (C): a conductive filler.