A silicone-free thermal interface for placement along a thermal dissipation pathway is provided for long-term durability. The thermal interface is formed from a multi-part composition and cured in place to obtain a conformable coating with low durometer hardness, which is maintained by a non-crosslinked diluent product formed from a reactive diluent system.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

The present disclosure relates to an epoxy resin of which distribution of molecular weight having distribution range of molecular weight of 300 to 2,000,000 is adjusted such that an upper limit value is increased to a maximum of 2,000,000, a method of preparing the same, a composition comprising the same, and a use thereof. The epoxy resin having controlled distribution of molecular weight of the present disclosure may have improved thermal properties of an epoxy system by expanding the distribution of molecular weight, and may exhibit excellent processability.

##STR00001##

The present invention relates to a resin composition, comprising (a) an epoxy resin; (b) a curing agent comprising the structure of formula C1; (c) an inorganic filler; wherein R.sup.C1 is (a) a siloxane group of formula C1a or (b) or both a siloxane group of formula C1a and an ester group of formula C1b; R.sup.C2 is selected from a bulky C.sub.4 to C.sub.12 alkyl group comprising at least one tertiary or quaternary carbon atom; R.sup.C11, R.sup.C12, R.sup.C13 are independently selected from methyl, ethyl and 1-propyl; R.sup.C14 is selected from a linear or branched C.sub.1 to C.sub.8 alkyl; X.sup.C1 is selected from a divalent C.sub.1 to C.sub.4 alkanediyl group; and n is an average number of repeating units and is from 1.05 to 200.

A silicone copolymer represented by formula (1) or (2) and as defined herein:

##STR00001##

Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

A silicone oil-treated fumed silica and a method of producing the silicone oil-treated fumed silica are provided. The silicone oil-treated fumed silica, which has the following physical properties: A) the silicone oil-treated fumed silica has a degree of hydrophobicity of 68 vol % or more; B) the silicone oil-treated fumed silica has a silicone oil fixation rate of from 60 mass % to 95 mass %; and C) a composition obtained by adding 6 parts by mass of the silicone oil-treated fumed silica to 100 parts by mass of an amine composition containing trimethylolpropane polyoxypropylene triamine and 1,3-bis(aminomethyl)cyclohexane at a mass ratio of 95:5 has a viscosity of 4,000 mPa.Math.s or more after the composition is left to stand at 25° C. for 1 hour.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.

Hardener composition for an addition-polymerisation-curable synthetic fixing mortar system for embedding anchoring means in mortar in holes or crevices, wherein the hardener composition includes oligomeric siloxanes having on average per molecule at least one or preferably two or more organic radicals that carry one or more (secondary or primary) amino and/or thiol groups that react with isocyanate or epoxy groups in the addition reaction and having on average per molecule at least one or more hydrolysable groups, and, in addition, can include one or more further customary additives, to synthetic fixing mortar systems including such a hardener composition, to the use of such synthetic fixing mortar systems for embedding anchoring means in mortar in holes or crevices and to methods of producing and using the synthetic fixing mortar systems and the hardener composition.

A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.

##STR00001##