The present disclosure relates to gel compositions comprising the reaction product of at least one epoxidized molecule and at least one crosslinker, which has the benefit of compatibility with personal care components and the resulting personal care formulations. The present disclosure also relates to methods of preparing gel compositions.

A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

Provided is a method for producing a polymer, characterized by reacting (A) an epoxy compound having two or more epoxy groups in the molecule with (B) a reactive compound having, in the molecule, two or more functional groups reactive with epoxy groups, in the presence of (C) a polymerization catalyst and (D) a cocatalyst.

A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).

Curing agents for epoxy monomers are prepared from the partial esterification of citric acid with certain alkyl or alkenyl alcohols. These curing agents, which contain mixtures of unreacted citric acid and monoalkyl or monoalkenyl citrate, and which are substantially free of trialkyl or trialkenyl citrate, are used without co-solvents for preparing biobased resins from plant oil-derived epoxides. The resulting biobased resins can in turn be used to prepare thermo set materials and biocomposites.

An aqueous dispersion comprising at least one fatty acid-modified epoxy amine adduct wherein the fatty acid has an iodine number of lower than 30 and at least one polymer obtained from the polymerization of one or more ethylenically unsaturated monomers and their use for forming coatings or binder agents, especially for decorative and protective coating applications on various substrates.

The present disclosure relates to a curing composition comprising: a) a condensation product of at least one carboxylic acid having 20-60 carbon atoms and at least two carboxyl groups and/or at least one ester derived from a carboxylic acid having 20-60 carbon atoms and at least two carboxyl groups; and at least one polyoxyalkyleneamine, wherein the polyoxyalkyleneamine includes: I) at least two oxyalkylene moieties; and II) at least two primary amino groups; and b) at least one amine having at least one amino group. Also provided are an adhesive composition comprising the curing composition, usage of the adhesive, a turbine blade for wind energy comprising the adhesive composition, and a method for manufacturing the curing composition.

The present disclosure provides a fire retardant composition that includes a non-intumescent composition and an intumescent composition, fire retardant coatings including the same, and methods of preparation and use thereof.

A resist underlayer film-forming composition including: a resin having a repeating structural unit including at least one —C(═O)—O— group in a main chain and a repeating structural unit including at least one hydroxy group in a side chain, or including at least one —C(═O)—O— group in a main chain and at least one hydroxy group in a side chain, wherein none of these units have an organic group containing an epoxy or oxetane ring; an acid catalyst or salt thereof in an amount of 0.1 to 10 parts by mass relative to 100 parts by mass of the resin, when the catalyst is a monovalent acid, an acid dissociation constant pKa is −0.5 or less in 25° C. water, or when a multivalent acid, an acid dissociation constant pKa.sub.1 is −0.5 or less in 25° C. water; and a solvent, wherein the composition does not include a monomer crosslinking agent.

A curing agent for curing a resin, includes a mixture of an organic acid and an ester.