C08G59/4207

CURED EPOXY RESIN COATING
20230021884 · 2023-01-26 ·

A coating for coating a substrate, includes an epoxy resin derived from an oil and cured using a curing agent including a mixture of a carboxylic acid having at least two acid functionalities and an ester.

FURANIC DIGLYCIDYL ETHERS AND ESTERS AND USE THEREOF

The present disclosure provides diglycidyl ethers and esters of 2,4-furandimethanol (2,4-FDME) and of 2,4-furandicarboxylic acid (2,4-FDCA), methods of making diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA, epoxy resins derived from diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA, and methods of making epoxy resins derived from diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA.

CHEMICAL-RESISTANT POLYVALENT CARBOXYLIC ACID-CONTAINING PROTECTIVE FILM
20220404706 · 2022-12-22 · ·

A protective film forming composition which has a good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even for a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using the composition; a substrate with a resist pattern; and a method for producing a semiconductor device. This composition contains: (A) a compound having three or more carboxyl groups; (B) a resin or a monomer; and a solvent. The compound (A) having three or more carboxyl groups preferably has a ring structure. This ring structure is preferably selected from among an aromatic ring having 6-40 carbon atoms, an aliphatic ring having 3-10 carbon atoms, and a heterocyclic ring.

ROOM TEMPERATURE IONIC LIQUID CURING AGENT
20220356298 · 2022-11-10 · ·

Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I):

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wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15° C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.

METHOD FOR PRODUCING POLYMER

Provided is a method for producing a polymer, comprising: a first step for synthesizing a crude polymer by reacting a monomer containing a pyrimidinetrione structure, an imidazolidinedione structure, or a triazinetrione structure, in an organic solvent in the presence of a quaternary phosphonium salt or quaternary ammonium salt; and a second step for precipitating and separating a purified polymer by mixing a poor solvent with the crude polymer-containing solution obtained in the first step.

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM

Provided is a composition which is for forming a resist underlayer film and with which the amount of a sublimate derived from a low-molecular-weight component such as an oligomer can be reduced, the composition comprising, for example, an organic solvent and a polymer having a repeating unit represented by formula (1-1), wherein the content of a low-molecular-weight component having a weight average molecular weight of 1,000 or less is 10 mass % or less in the polymer.

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EPOXY-DERIVED COVALENT ADAPTABLE NETWORKS AND METHODS OF THEIR PRODUCTION

The invention relates to a composition comprising an epoxy-derived covalent adaptable network, preferably an epoxy vitrimer comprising at least one unit of formula (I)

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The invention further relates to a method for preparing a composition comprising an epoxy-derived covalent adaptable network by contacting at least one amine comprising primary, at least one vinylogous precursor comprising vinylogous precursor groups and at least one epoxide comprising epoxide groups whereby the number of amine groups, the number of vinylogous precursor groups and the number of epoxide groups is controlled.

STIMULI-RESPONSIVE LIQUID CRYSTALLINE NETWORKS
20170240811 · 2017-08-24 ·

Liquid crystalline network compositions comprising azo-containing aromatic epoxy units cross-linked with alkylene diacid units having alkylene segments containing at least one methylene unit, wherein the azo-containing aromatic epoxy units and alkylene diacid units are connected by ester linkages resulting from ring-opening esterification between the epoxy units and alkylene diacids, and wherein the azo-containing aromatic epoxy units and alkylene diacid units are in a molar ratio that results in the liquid crystalline network composition exhibiting a glass transition temperature (T.sub.g) of at least 25° C. Methods for producing these compositions and their use in light- or thermal-activated physical deformation, shape memory applications, and self-healing, as well as their ability to be recycled and used in additive manufacturing processes are also described.

Elastomer derived from epoxidized vegetable oil

Disclosed is an elastomer synthesized by a reacting epoxidized vegetable oil with carboxylic acid to form the elastomer compound. More specifically, disclosed herein is an elastomer compound having a polyester component. The method for making the elastomer comprises mixing a polybasic acid with an alcohol solvent to form a solution, reacting said solution having carboxylic groups with epoxidized vegetable oil, and heating the solution at a range of approximately 50° C. to 80° C., wherein an amorphous polyester elastomer is formed. Also disclosed is an elastomer foam product formed by a reacting epoxidized vegetable oil with carboxylic acid.

CONDUCTIVE PASTE COMPOSITION

A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.