An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

The patent application discloses a degradable thermoset composite. The composite comprises a reaction product of an epoxy resin mixture, a cross-linker, a catalyst. The epoxy resin mixture may comprise at least one aromatic epoxy resins having a glass transition temperature greater than or equal to 150° C. The reaction product may have a glass transition temperature greater than or equal to 110° C. as measured by DSC or DMA.

A method for recycling matrix residues includes steps of degrading a target epoxy to form matrix residues, collecting the matrix residues, and adding the matrix residues into a polymer-forming formulation. Characteristically, the polymer-forming formulation includes multifunctional anhydride monomers and polyfunctional co-reactant monomers.

An object of the present invention is to provide a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. A curing catalyst for epoxy resin, which contains an epoxy imidazole adduct having structural formula (I) below, is prepared. Furthermore, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition are prepared. (In the formula, R.sup.1 is a group selected from hydrogen, phenyl, and C1-C17 alkyls, and R.sup.2 and R.sup.3 are each independently a group selected from hydrogen and C1-C6 alkyls.)

##STR00001##

The present disclosure relates to rubber polymers of ethylene-glycidylmethacrylate-vinyl acetate polymer as modifiers in epoxy resins. In particular ethylene-glycidylmethacrylate-vinyl acetate rubber polymers comprising phthalic anhydride modified glycidyl methacrylate monomer units.

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm.sup.2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

A novolak resin including a partial structure represented by —C(CF.sub.3)H—. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by —C(CF.sub.3)H—. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by —C(CF.sub.3)H—. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by —C(CF.sub.3)H— with epihalohydrin in a presence of a base.

Provided are a resin composition for sealing an optical semiconductor providing both UV transmission and heat resistance, and a molded resin product for sealing an optical semiconductor, an optical semiconductor-sealing material, and an optical semiconductor device each including the same. The resin composition satisfies the relationship X=(A1×A2)/A3+(B1×B2)/B3+ . . . <0.0005 wherein A1 represents the mass ratio of an aromatic compound, A2 represents the number of aromatic rings per molecule of the aromatic compound, A3 represents the molecular weight of the aromatic compound, and A, B, . . . each represent an aromatic compound. The composition contains an epoxy, an alicyclic acid anhydride, and an antioxidant. When formed into a cured product (size: 50 mm in width×50 mm in length×1 mm in thickness), a linear transmittance at 300 nm is 80% or higher and a linear transmittance at 400 nm is 95% or higher.

Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).