An epoxy adhesive that is adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques is disclosed. The epoxy adhesive can include one or more epoxy resins and one or more solvents that are used to dissolve the one or more epoxy resins. An adduct, a tackifier, and fumed silica can also be added to the adhesive.

A method of forming a cured epoxy material includes pre-reacting a phenylene ether oligomer with an anhydride hardener before adding an epoxy resin and a curing promoter, then curing the resulting composition. The method provides an improved balance of heat resistance and toughness relative to corresponding methods in which the phenylene ether oligomer is pre-reacted with the epoxy resin prior to addition of hardener, and in which all components are mixed simultaneously. The cured epoxy material can be used in the composite core of an aluminum conductor composite core reinforced cable.

An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

By using a composition for forming a light scattering composite, including surface-modified inorganic oxide particles surface-modified by a surface modification material having one or more functional groups selected from an alkenyl group, an HSi group, and an alkoxy group, and an uncured matrix resin composition, in which an average dispersed particle diameter of the surface-modified inorganic oxide particles is 3 nm or more and 150 nm or less, and a content of the surface-modified inorganic oxide particles is 0.01% by mass or more and 15% by mass or less in a total solid content, it is possible to provide a white optical semiconductor light emitting device which has excellent light transmitting properties and scattering properties even if the content of light scattering particles is reduced, and as a result, further suppresses blue light irradiation and enhances a white light luminance, while enhancing color rendering properties.

In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.

An epoxy adhesive that is adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques is disclosed. The epoxy adhesive can include one or more epoxy resins and one or more solvents that are used to dissolve the one or more epoxy resins. An adduct, a tackifier, and fumed silica can also be added to the adhesive.

The present invention relates to compounds comprising the epoxide functional reaction product of: (a) at least one molecule comprising two terminal epoxy-reactive moieties; with (b) two molecules comprising two epoxide moieties; wherein, said compound comprises, pendent to the residue of (a) (i.e. as a side chain of the molecule), one or more polyoxyalkylene or polyoxyalkylene alkyl ether radical(s) having a weight average molecular weight of at least 400. Also provided are aqueous coating compositions comprising such compounds.

Disclosed herein is a capped poly(phenylene ether) having an activated ester end group and a structure as further defined herein. The capped poly(phenylene ether) can be particularly useful in curable compositions, thermoset compositions, and articles formed therefrom.

To provide an epoxy resin composition that is suitable for producing optical sheets which exhibit excellent transparency, heat resistance, strength, smoothness and light resistance, and a cured product thereof.

An epoxy resin composition for optical3 sheets, the composition comprising a polyvalent carboxylic acid (A) represented by formula (I):

##STR00001## (wherein, R.sup.1's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; q represents the number of substituent R.sup.1's, and represents an integer from 1 to 4; and P represents any one of the following x, y and z):

##STR00002## (wherein, there may be a plural number of R.sup.2's per ring, and R.sup.2's each independently represent a hydrogen atom or a methyl group; and * represents a bonding site linked to the oxygen atom; y. A linear alkylene linker having 6 to 20 carbon atoms, with a main chain having 3 or more carbon atoms and being substituted with an alkyl group in at least one site);

##STR00003## (wherein, R's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; and * represents a bonding site linked to the oxygen atom, and an epoxy resin (B) having an aliphatic cyclic structure in the molecule).

An epoxy adhesive that is adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques is disclosed. The epoxy adhesive can include one or more epoxy resins and one or more solvents that are used to dissolve the one or more epoxy resins. An adduct, a tackifier, and fumed silica can also be added to the adhesive.