This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

Provided are a fiber-reinforced composite material excellent in heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Further provided are a fiber-reinforced composite material having less volatile matters during the curing time, and having excellent heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Provided are: an epoxy resin composition for a fiber-reinforced composite material, comprising an amine type epoxy resin [A], an aromatic amine curing agent [B], and a block copolymer [C] having a reactive group capable of reacting with an epoxy resin; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg. Further provided are: an epoxy resin composition comprising an epoxy resin [A] having two or more of four- or more-membered ring structures, and having either one of a glycidyl amino group directly bonded to the ring structure or a glycidyl ether group directly bonded to the ring structure, epoxy resin [B] having three or more of functional groups, a curing agent [C], and an elastomer component [D]; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg.

In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.

To provide: a transparent conductive substrate containing silver nanowires and having excellent optical characteristics, electrical characteristics and light resistance; and a method for producing the same. A transparent conductive substrate characterized by comprising: a substrate; a transparent conductive film formed on at least one principal surface of the substrate, and containing a binder resin and conductive fibers; and a protective film formed on the transparent conductive film, wherein the thermal decomposition starting temperature of the binder resin is 210° C. or higher, and the protective film is a thermal-cured film obtained using a thermosetting resin.

A material comprising at least about 10% by weight polyvinyl butyral, a thermoplastic epoxy, wherein the ratio of polyvinyl butyral to thermoplastic epoxy is about 1 to 10 to about 1 to 4, and at least 2% but less than 15% by weight adducted carboxyl-terminated polymer, wherein the material has a strain to failure of greater than 2% and a modulus of at least 700 MPa.

The present invention provides an aqueous dispersion containing the following component (A) and component (B): (A) a polyolefin modified with an α,β-unsaturated carboxylic acid and/or a derivative thereof, having a weight-average molecular weight of not less than 100,000, a crystallinity degree larger than 10%, and an acid value of 1-30 mg KOH/g, and (B) a polyolefin modified with an α,β-unsaturated carboxylic acid and/or a derivative thereof, having a weight-average molecular weight of less than 100,000, and an acid value of 15-50 mg KOH/g, the dispersion having a mass ratio of a content of component (A) and a content of component (B) (content of component (A)/content of component (B)) of 55/45-95/5.

Thermosetting epoxy resin compositions on the one hand at room temperature in the incompletely cured state exhibit extremely slight alteration in shape and on the other hand develop a high surface tack, and, moreover, in the fully cured state are of high impact strength and at the same time exhibits high adhesion, particularly to metallic substrates. These compositions are ideally suited to the production of self-adhesive reinforcing elements.

An object of the present invention is to provide an adhesion improver for a carbon fiber-reinforced polyolefin-based resin composition that provides improved mechanical characteristics such as bending strength and bending elastic modulus. The adhesion improver is used for a carbon fiber-reinforced resin composition including carbon fibers and a polyolefin-based resin. The adhesion improver includes an acid-modified polyolefin-based resin unit and an epoxy resin unit. The acid-modified polyolefin-based resin unit and the epoxy resin unit are linked via an ester structure, and the epoxy resin unit includes a secondary hydroxy group.

To provide: a transparent conductive substrate containing silver nanowires and having excellent optical characteristics, electrical characteristics and light resistance; and a method for producing the same. A transparent conductive substrate characterized by comprising: a substrate; a transparent conductive film formed on at least one principal surface of the substrate, and containing a binder resin and conductive fibers; and a protective film formed on the transparent conductive film, wherein the thermal decomposition starting temperature of the binder resin is 210 C. or higher, and the protective film is a thermal-cured film obtained using a thermosetting resin.

Thermosetting epoxy resin compositions on the one hand at room temperature in the incompletely cured state exhibit extremely slight alteration in shape and on the other hand develop a high surface tack, and, moreover, in the fully cured state are of high impact strength and at the same time exhibits high adhesion, particularly to metallic substrates. These compositions are ideally suited to the production of self-adhesive reinforcing elements.