A bio-based resin obtained from a reaction mixture comprising a glycidyl ether component and a bio-based component comprising a fatty acid and a rosin acid, wherein the glycidyl ether component comprises at least two epoxide groups.

The present invention relates to a tape comprising an epoxy based resin having ester groups and ethylenically unsaturated groups, alternatively a hybrid resin. The tape of the invention can be used for insulation in electrical machines, especially in high voltage machines. Preferably, the tape of the invention is used in combination with a composition for impregnating and/or coating a substrate comprising the tape of the invention, wherein the composition further comprises a second epoxy based resin having ester groups and ethylenically unsaturated groups, also an hybrid resin, a diluent and an initiator for a radical polymerization.

A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure below or an imidazole represented by the structure below: ##STR00001##
where R.sub.1=H, a C1-C20 straight chain or branched alkyl, or a monocyclic aryl; R.sub.2=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The carboxylic acid is represented by RCOOH; R=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The composition comprises a lower ratio of epoxy resin to anhydride (1:0.4-0.6) than typically used (1:0.8-1.1). In addition, it uses a higher loading of the hindered latent tertiary amine or the imidazole in combination with the carboxylic acid (wt % ratio of combined amine and carboxylic acid to anhydride ˜10%). With this composition a full cure can be achieved in less than 2 hr at a significantly lower temperature (˜100° C.).

A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure below or an imidazole represented by the structure below:

##STR00001##

where R.sub.1=H, a C1-C20 straight chain or branched alkyl, or a monocyclic aryl; R.sub.2=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The carboxylic acid is represented by RCOOH; R=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The composition comprises a lower ratio of epoxy resin to anhydride (1:0.4-0.6) than typically used (1:0.8-1.1). In addition, it uses a higher loading of the hindered latent tertiary amine or the imidazole in combination with the carboxylic acid (wt % ratio of combined amine and carboxylic acid to anhydride 10%). With this composition a full cure can be achieved in less than 2 hr at a significantly lower temperature (100 C.).

A curable oligomer is the reaction product of: x equivalents of at least one diepoxy a); y1 equivalents of at least one unsaturated carboxylic acid b); and y2 equivalents of at least one polycarboxylic acid c) comprising at least three carboxylic acid groups. x is defined as the number of moles of epoxy groups in component a), y1 is defined as the number of moles of carboxylic acid groups in component b), and y2 is defined as the number of moles of carboxylic acid groups in component c).

The present invention is a composition for forming an organic film, containing: (A) a material for forming an organic film; (B) a polymer having a repeating unit represented by the following general formula (1); and (C) a solvent, where W.sub.1 represents a saturated or unsaturated divalent organic group having 2 to 50 carbon atoms and having one or more fluorine-containing structures represented by the following formulae (2), and W.sub.2 represents a saturated or unsaturated divalent organic group having 2 to 50 carbon atoms. This can provide: a composition for forming an organic film which is excellent in film-formability on a substrate and filling property, suppresses humps in an EBR process, and has an excellent process margin when used for an organic film for a multilayer resist process; a method for forming an organic film, using the composition; a patterning process; and a polymer to be contained in the composition for forming an organic film.

##STR00001##