The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.

A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.

Provided is a composition which is for forming a resist underlayer film and with which the amount of a sublimate derived from a low-molecular-weight component such as an oligomer can be reduced, the composition comprising, for example, an organic solvent and a polymer having a repeating unit represented by formula (1-1), wherein the content of a low-molecular-weight component having a weight average molecular weight of 1,000 or less is 10 mass % or less in the polymer.

##STR00001##

The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able to cure this/these thermosetting resin(s), wherein at least one curing compound is provided for curing during the additive manufacturing process and at least one curing compound is provided for curing during a post-curing step. The invention furthermore relates to a method of producing a cured 3D thermoset object comprising at least the steps of subjecting the material according to the present invention to an additive manufacturing process, obtaining a partially cured 3D thermoset object and subsequently subjecting the partially cured 3D thermoset object to a post-curing process to further cure the 3D thermoset object Additionally, the invention relates to the use of the material in an SLS, FFF, CBAM, FGF or powder bed additive manufacturing process.

Provided are a prepreg in which reinforcing fibers are impregnated with an epoxy resin composition containing an epoxy resin (A) and an epoxy resin curing agent (B) containing a reaction product (X) of a component (x1) and a component (x2) described below, a fiber-reinforced composite material that is a cured product of the prepreg, a method for producing the prepreg, and a method for producing a high-pressure gas storage tank.

(x1) At least one selected from the group consisting of meta-xylylenediamine and para-xylylenediamine

(x2) At least one selected from the group consisting of unsaturated carboxylic acids represented by General Formula (1) below and derivatives thereof.

##STR00001##

(In Formula (1), R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having from 1 to 8 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 13 carbons.)

Provided are a prepreg in which reinforcing fibers are impregnated with an epoxy resin composition containing an epoxy resin (A) and an epoxy resin curing agent (B) containing a reaction product (X) of a component (x1) and a component (x2) described below, a fiber-reinforced composite material that is a cured product of the prepreg, a method for producing the prepreg, and a method for producing a high-pressure gas storage tank.

(x1) At least one selected from the group consisting of meta-xylylenediamine and para-xylylenediamine

(x2) At least one selected from the group consisting of unsaturated carboxylic acids represented by General Formula (1) below and derivatives thereof.

##STR00001##

(In Formula (1), R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having from 1 to 8 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 13 carbons.)

Disclosed is an environment-friendly and flame-retardant abradable seal coating material with an ultra-low density and a use method thereof. The seal coating material includes a component A and a component B packaged separately; the component A includes 20-30 wt % of a curing agent for bisphenol A epoxy resin, 20-30 wt % of a liquid phosphorus-containing curing agent, 20-40 wt % of a hollow glass microbead, 1-5 wt % of 2,4,6-tris(dimethylaminomethyl)phenol, 5-15 wt % of dimethyl methylphosphonate and 0.5-3 wt % of a silane coupling agent; the component B includes 30-40 wt % of a bisphenol A epoxy resin, 30-40 wt % of a liquid phosphorus-containing epoxy resin, 20-30 wt % of a hollow glass microbead, 0-10 wt % of a liquid acrylonitrile-butadiene rubber and 0.5-3 wt % of a silane coupling agent. The method includes: mixing the component A and the component B to obtain a coating, and applying the obtained coating to a surface of a part for curing.

Disclosed is an environment-friendly and flame-retardant abradable seal coating material with an ultra-low density and a use method thereof. The seal coating material includes a component A and a component B packaged separately; the component A includes 20-30 wt % of a curing agent for bisphenol A epoxy resin, 20-30 wt % of a liquid phosphorus-containing curing agent, 20-40 wt % of a hollow glass microbead, 1-5 wt % of 2,4,6-tris(dimethylaminomethyl)phenol, 5-15 wt % of dimethyl methylphosphonate and 0.5-3 wt % of a silane coupling agent; the component B includes 30-40 wt % of a bisphenol A epoxy resin, 30-40 wt % of a liquid phosphorus-containing epoxy resin, 20-30 wt % of a hollow glass microbead, 0-10 wt % of a liquid acrylonitrile-butadiene rubber and 0.5-3 wt % of a silane coupling agent. The method includes: mixing the component A and the component B to obtain a coating, and applying the obtained coating to a surface of a part for curing.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.