An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4):

[A]: epoxy resin
[B]: aromatic diamine
[C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.60 or less in a ratio m/M of a molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition. (3): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (2) is 0.01 or more and 0.20 or less; and (4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

Disclosed herein are crosslinked polycarbonates, composition thereof and methods thereof. The crosslinked polycarbonates can be prepared from allyl or epoxy polycarbonates. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

An etheramine mixture comprising one or more polyether diamines, methods for its production, and its use as a curing agent for epoxy resins. The etheramine mixture may also be used in the preparation of polyamides and polyurea compounds.

The present invention relates to an epoxy resin system having a phase separation structure, a preparation method therefor and an application thereof. After mixing an epoxy resin, an amine curing agent and an epoxy diluent, pre-polymerization is carried out to obtain a prepolymer 1; or, after mixing an epoxy resin and an amine curing agent, pre-polymerization is carried out to obtain a prepolymer 1; after mixing an epoxy resin, an anhydride curing agent and an accelerator, polymerization is carried out to obtain a prepolymer 2; and after the prepolymer 1 and the prepolymer 2 are mixed, curing is carried out to obtain an epoxy resin system having a phase separation structure. The present invention controls the formation of a thermosetting epoxy resin system having a phase separation structure by means of preparing different epoxy resin pre-polymerization systems and using an interface reaction between the different pre-polymerization systems.

The present invention relates to an epoxy resin system having a phase separation structure, a preparation method therefor and an application thereof. After mixing an epoxy resin, an amine curing agent and an epoxy diluent, pre-polymerization is carried out to obtain a prepolymer 1; or, after mixing an epoxy resin and an amine curing agent, pre-polymerization is carried out to obtain a prepolymer 1; after mixing an epoxy resin, an anhydride curing agent and an accelerator, polymerization is carried out to obtain a prepolymer 2; and after the prepolymer 1 and the prepolymer 2 are mixed, curing is carried out to obtain an epoxy resin system having a phase separation structure. The present invention controls the formation of a thermosetting epoxy resin system having a phase separation structure by means of preparing different epoxy resin pre-polymerization systems and using an interface reaction between the different pre-polymerization systems.

Processes for producing polymer microcapsules using vicinal functional oligomers are also described. The vicinal functional oligomers can be made by polymerizing an acrylate monomer, a styrene monomer, or both in the presence of a chain transfer agent. The vicinal functional oligomers can be reacted with epichlorohydrin to form vicinal epoxies. The vicinal epoxies can be reacted with polyamines to form epoxy polymer microspheres. The vicinal epoxies can be reacted with carbon dioxide in the presence of a catalyst to form vicinal cyclic carbonates. The vicinal cyclic carbonates can be reacted with polyamines to form isocyanate-free polymer microspheres. Polymer microspheres made by the processes are also described.

Processes for producing polymer microcapsules using vicinal functional oligomers are also described. The vicinal functional oligomers can be made by polymerizing an acrylate monomer, a styrene monomer, or both in the presence of a chain transfer agent. The vicinal functional oligomers can be reacted with epichlorohydrin to form vicinal epoxies. The vicinal epoxies can be reacted with polyamines to form epoxy polymer microspheres. The vicinal epoxies can be reacted with carbon dioxide in the presence of a catalyst to form vicinal cyclic carbonates. The vicinal cyclic carbonates can be reacted with polyamines to form isocyanate-free polymer microspheres. Polymer microspheres made by the processes are also described.

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.