Compositions and curing agents comprising a benzylated Mannich base composition. The benzylated Mannich base composition includes a reaction product of (a) a substituted phenolic compound having at least one substituent of formula (I):

##STR00001##

wherein R.sub.1 is each independently a linear or branched alkyl group having 1 to 4 carbon atoms, and R.sub.2 is hydrogen, methyl, ethyl or phenyl, with (b) a benzylated polyalkylene polyamine (II):

##STR00002##

wherein R.sub.A is substituted or unsubstituted benzyl; R.sub.B is each independently R.sub.A, or a hydrogen atom, or a group selected from C.sub.1-C.sub.16 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups; X, Y, and Z are independently selected from C.sub.2-C.sub.10 alkylene, and cycloalkylene groups; y is an integer from 0 to 7, and z is an integer from 0 to 4; and, optionally, (c) a multifunctional amine. Amine-epoxy compositions and articles produced from these compositions are also disclosed.

Disclosed is a method for producing a prepreg, the prepreg having: a reinforcing fiber layer including reinforcing fibers and a resin composition containing component (A), component (B), and component (C), the reinforcing fibers being impregnated with the resin composition in between the fibers; and a surface fiber layer provided on the surface of the reinforcing fiber layer and including a fabric including polyamide fibers and a resin composition containing component (A), component (B), and component (C), the polyamide fibers being impregnated with the resin composition in between the fibers. The method for producing a prepreg includes a disposition step of disposing the fabric on the surface of a reinforcing fiber base material and an impregnation step of supplying a resin composition to the reinforcing fiber base material and impregnating the reinforcing fibers with the resin composition in between the fibers.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

An adhesion promoter, a curable composition containing the adhesion promoter, a cured composition formed from the curable composition, and an article containing the cured composition are provided. The adhesion promoter, which is formed by reacting a polyepoxide with a mercaptosilane that has a hydrolyzable silyl group, has at least one epoxide group and at least one hydrolyzable silyl group. The epoxide groups allow incorporation of the adhesion promoter into the polymeric matrix of the cured composition and the hydrolyzable silyl groups allow bond formation with various substrates.

A composition including: —at least one silane group-containing polymer with a silicon content ranging from 0.6 to 2 wt. %, obtained by reacting at least one isocyanate group-containing polymer and at least one amino-, mercapto-, or hydroxysilane, —at least one liquid epoxy resin, and—at least one polyamine with at least three amine hydrogens which are reactive towards epoxy groups. The composition facilitates adhesives, coatings, or sealing compounds with a good storage stability, a fast curing time, even in the event of moisture or humidity, a surprisingly high degree of strength while having a high degree of elasticity, a high degree of resistance against further tearing, a high degree of resistance in particular against glycol/water mixtures, and a high degree of adhesion to many substrates. When used on metals such as steel or aluminum, the composition protects same against corrosion.

A multi-part curable composition includes an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety, an alicyclic structure-containing amine (E1), and a B part including an epoxy resin (C). Each of the reactive silicon groups of the polymer (A) and polymer (B) are represented by —SiR.sup.5.sub.cX.sub.3-c. R.sup.5 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxy group or a hydrolyzable group, and c is 0 or 1. A multi-part curable composition includes an A part including the polymer (A), polymer(B), and an epoxy resin curing agent (D) having a tertiary amine moiety, and a B part including an epoxy resin (C), where either or both of the A and B parts include an amino alcohol compound (E2).

The present invention provides a composition for forming a thermally conductive material, from which a thermally conductive material having excellent adhesiveness can be obtained. In addition, the present invention provides a thermally conductive material and a surface-modified inorganic substance.

The composition for forming a thermally conductive material of the present invention is a composition for forming a thermally conductive material containing a surface-modified inorganic substance and a thermosetting compound, the surface-modified inorganic substance satisfying at least one of Requirement 1 or Requirement 2.

Requirement 1: The surface-modified inorganic substance includes a surface-modified inorganic substance X containing the inorganic substance, and a surface modifier A and a surface modifier B adsorbed on a surface of the inorganic substance.

Requirement 2: The surface-modified inorganic substance includes a surface-modified inorganic substance A containing the inorganic substance and the surface modifier A adsorbed on the surface of the inorganic substance, and a surface-modified inorganic substance B containing the inorganic substance and the surface modifier B adsorbed on the surface of the inorganic substance.

A two-component adhesive includes agent A containing an epoxy resin and agent B containing a polymer having a crosslinkable silicon group and an epoxy resin curing agent, wherein agent A and/or agent B contain(s) a core-shell rubber particle, and a condensation catalyst for the crosslinkable silicon group. Another adhesive contains an epoxy resin, a core-shell rubber particle, a polymer having a crosslinkable silicon group, an epoxy resin curing agent, and a condensation catalyst for the crosslinkable silicon group, wherein a cured product of the adhesive has a breaking strength (tensile strength at rupture) of 5 MPa or more and an elongation at break (elongation at rupture) of 30% or more, and has storage elastic moduli at 1 Hz in tensile mode of 100 to 1000 MPa at 20° C. and 50 to 1000 MPa at 80° C.

A curable benzoxazine resin composition for a fiber-reinforced composite material is provided which contains at least a component [A], a component [B], and a component [C]. The component [A] includes at least one multifunctional benzoxazine resin having a non-hydrocarbon linkage such as carbonyl, oxygen, sulfur, sulfone or sulfoxide between aromatic moieties. The component [B] includes at least one multifunctional benzoxazine resin having a direct bond or a hydrocarbon linkage between aromatic moieties. The component [C] includes at least one cycloaliphatic epoxy resin containing at least two epoxy groups which are part of cycloaliphatic rings. The curable benzoxazine resin composition is useful in the molding of fiber-reinforced composite materials. More particularly, the curable benzoxazine resin composition makes possible a fiber-reinforced composite material where the cured material obtained by heating has superior performance in extreme use environments, such as high temperature and high compressive load.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).