Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.

Disclosed herein are thermal interface material comprising liquid epoxy resin that is free of aromatic groups and high loading of aluminum trihydroxide and the use thereof in battery powered vehicles.

A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.

Phenalkamine epoxy curing agent for outdoor top coat application A novel Mannich reaction based phenalkamine for outdoor application which includes a) para substituted phenol reaction product with polyamine and aldehyde, b) adduct with epoxy resin containing two glycidyl groups. Phenalkamine produced is diluted with an inert solvent. The top coat shows good ultra violet radiation stability, low colour, colour and gloss retention, low viscosity with excellent corrosion resistance. The two-pack epoxy resin paint composition based on Phenalkamine curing agent for outdoor application has very good adhesion as undercoat and very good over coating performance as top coat.

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

The present invention relates to new compounds based on cardanol based which can be used as curing agents, compositions comprising the novel compounds, the manufacture of such compounds and of such compositions, and the use of these 5 compositions, in particular in a potting process in electrical and electronic components and devices.

An epoxy resin composition with epoxy groups and active hydrogens having different molar equivalents includes an epoxy resin component and a curing agent component. A mixing ratio of the epoxy resin component and the curing agent component is a mixing ratio of a cured product with the highest glass transition temperature Tg among cured products with different mixing ratios measured experimentally. According to a weight percentage in a total weight of the epoxy resin component, the epoxy resin component includes: 50 wt % to 100 wt % of a bisphenol A epoxy resin. According to a weight percentage in a total weight of the curing agent component, the curing agent component includes: 60 wt % to 98 wt % of polyetheramine (PEA) and 2 wt % to 20 wt % of a low-viscosity Mannich base.

A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a trivalent or higher polyvalent phenol type epoxy compound (B), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

Compositions for a curable substance for fixing purposes, comprising an epoxy component (a), which contains curable epoxides, and a hardener component (b), which comprises a Mannich base formulation, obtainable by reaction of specific amines, and/or mixtures of styrenated phenols with low molecular weight amines, to novel Mannich base formulations or mixtures of styrenated phenols with low molecular weight amines, and to the use of such Mannich base formulations and/or of such mixtures of styrenated phenols with low molecular weight amines, and in each case especially further additional ingredients, especially in hardener components for epoxy resins.

A method for manufacturing a semiconductor apparatus, including preparing a first substrate provided with a pad optionally having a plug and a second substrate or device provided with a plug, forming a solder ball on at least one of the pad or plug of first substrate and the plug of second substrate or device, covering at least one of a pad-forming surface of first substrate and a plug-forming surface of second substrate or device with a photosensitive insulating layer, forming an opening on the pad or plug of the substrate or device that has been covered with photosensitive insulating layer by lithography, pressure-bonding the second substrate or device's plug to the pad or plug of first substrate with the solder ball through the opening, electrically connecting pad or plug of first substrate to second substrate or device's plug by baking, and curing photosensitive insulating layer by baking.