Patent classifications
C08G59/66
Polycarbonate containing compounds and methods related thereto
Disclosed herein are crosslinked polycarbonates, composition thereof and methods thereof. The crosslinked polycarbonates can be prepared from allyl or epoxy polycarbonates. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
Polycarbonate containing compounds and methods related thereto
Disclosed herein are crosslinked polycarbonates, composition thereof and methods thereof. The crosslinked polycarbonates can be prepared from allyl or epoxy polycarbonates. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD OF FORMING CURED FILM
A curable organopolysiloxane composition comprising: (A) a mercapto group-containing organopolysiloxane; (B) a compound containing in a molecule at least two groups that are at least one type of functional groups selected from a group consisting of acryloyl groups, methacryloyl groups, and epoxy groups; and (C) an amine compound that does not have a N—H bond and/or a phosphine compound that does not have a P—H bond. The composition has favorable curability even at a relatively low temperature, and forms a cured film with excellent bonding with regard to an article to be coated.
CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD OF FORMING CURED FILM
A curable organopolysiloxane composition comprising: (A) a mercapto group-containing organopolysiloxane; (B) a compound containing in a molecule at least two groups that are at least one type of functional groups selected from a group consisting of acryloyl groups, methacryloyl groups, and epoxy groups; and (C) an amine compound that does not have a N—H bond and/or a phosphine compound that does not have a P—H bond. The composition has favorable curability even at a relatively low temperature, and forms a cured film with excellent bonding with regard to an article to be coated.
Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device
Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
Use of functionalized alpha-angelica lactones
The present invention is directed to the use as a reactive component in the curing of compositions based on epoxy resins of a functionalized α-angelica lactone (XOMAL) having the general formula: ##STR00001##
wherein: R.sup.a is a C.sub.1-C.sub.30 alkyl, C.sub.3-C.sub.30 cycloalkyl, C.sub.6-C.sub.18 aryl or C.sub.2-C.sub.12 alkenyl group.
Use of functionalized alpha-angelica lactones
The present invention is directed to the use as a reactive component in the curing of compositions based on epoxy resins of a functionalized α-angelica lactone (XOMAL) having the general formula: ##STR00001##
wherein: R.sup.a is a C.sub.1-C.sub.30 alkyl, C.sub.3-C.sub.30 cycloalkyl, C.sub.6-C.sub.18 aryl or C.sub.2-C.sub.12 alkenyl group.
EPOXY RESIN COMPOSITION
A slightly colored or completely colorless epoxy resin composition includes an epoxy resin containing two or more epoxy groups in one molecule, a thiol compound containing two or more thiol groups in one molecule, and an amine compound, that forms a cured product having an a* value of −15 to 15 and a b* value of −15 to 15 as chromaticity features according to the color system.
EPOXY RESIN COMPOSITION
A slightly colored or completely colorless epoxy resin composition includes an epoxy resin containing two or more epoxy groups in one molecule, a thiol compound containing two or more thiol groups in one molecule, and an amine compound, that forms a cured product having an a* value of −15 to 15 and a b* value of −15 to 15 as chromaticity features according to the color system.
Epoxy stabilization using substituted barbituric acids
A curable, one-part epoxy/thiol resin composition comprising: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two primary thiol groups; a nitrogen-containing catalyst for the epoxy resin; and a substituted barbituric acid soluble in the one-part epoxy/thiol resin composition.