The composition includes a polyester resin comprising at least one α,β-unsaturated ester group, an epoxy resin, a compound comprising at least one hydroxyl group; and a photoinitiator that generates acid on exposure to actinic radiation. A method of repairing a damaged surface using the composition is also described.

The composition includes a polyester resin comprising at least one α,β-unsaturated ester group, an epoxy resin, a compound comprising at least one hydroxyl group; and a photoinitiator that generates acid on exposure to actinic radiation. A method of repairing a damaged surface using the composition is also described.

A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm.sup.2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm.sup.2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.

The invention relates to a composition containing at least one catalyst (C1) containing at least one atom of an element (M1) chosen from: Al, Sc, Ti, Mg, Mn, Fe, Co, Ni, Cu, Zn, Zr, Sn, Hf, Pb, Si, Sb and In; a catalyst (C2) comprising at least one atom of an element (M2) chosen from alkali metals and alkaline-earth metals; a thermosetting resin and/or a hardener for a thermosetting resin. The invention also relates to the use of this composition for rendering a resin which is in the thermoset state hot-deformable and nevertheless free of any residual stress after the deformation thereof; such a resin will advantageously retain its shape even if it is subsequently subjected to high temperatures. The invention relates, moreover, to kits for preparing the composition, to a thermoset-resin-based object obtained from a composition of the invention, to a process for manufacturing objects, to a process for hot-deformation of objects and to various possible uses of the compositions and objects of the invention.

The invention relates to a composition containing at least one catalyst (C1) containing at least one atom of an element (M1) chosen from: Al, Sc, Ti, Mg, Mn, Fe, Co, Ni, Cu, Zn, Zr, Sn, Hf, Pb, Si, Sb and In; a catalyst (C2) comprising at least one atom of an element (M2) chosen from alkali metals and alkaline-earth metals; a thermosetting resin and/or a hardener for a thermosetting resin. The invention also relates to the use of this composition for rendering a resin which is in the thermoset state hot-deformable and nevertheless free of any residual stress after the deformation thereof; such a resin will advantageously retain its shape even if it is subsequently subjected to high temperatures. The invention relates, moreover, to kits for preparing the composition, to a thermoset-resin-based object obtained from a composition of the invention, to a process for manufacturing objects, to a process for hot-deformation of objects and to various possible uses of the compositions and objects of the invention.

Techniques for supporting USB and video communication over an extension medium are provided. In some embodiments, an upstream facing port device (UFP device) is coupled to legacy connectors of a host device, and a downstream facing port device (DFP device) is coupled to a USB Type-C receptacle of the sink device that may provide both USB and DisplayPort information. The UFP device and DFP device communicate to properly configure the USB Type-C connection for use in the extension environment. In some embodiments, a source device is coupled to the UFP device via a USB Type-C connection, and legacy video and USB devices are coupled to the DFP device. The UFP device and DFP device again communicate to cause the source device to properly configure the USB Type-C connection for use in the extension environment.

An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

The present specification provides a polymer resin compound, a method for preparing the same, a photosensitive resin composition including the polymer resin compound, and a photosensitive material formed using the photosensitive resin composition.

The present invention provides a curable resin composition excellent in surface curability and internal curability in bonding adherend members without use of an organic tin catalyst. The curable resin composition includes the following components (A) to (E): component (A): an epoxy resin having 2 or more epoxy groups in a molecule; component (B): a bismuth catalyst; component (C): water having a pH of 8.0 or more; component (D): an organic polymer having 2 or more hydrolyzable silyl groups in a molecule; and component (E): a curing agent for an epoxy resin.