Patent classifications
C08G59/682
SEMICURED PRODUCT COMPLEX AND METHOD FOR PRODUCING SAME, CURED PRODUCT COMPLEX AND METHOD FOR PRODUCING SAME, AND THERMOSETTING COMPOSITION USED TO IMPREGNATE POROUS BODY
An aspect of the present invention provides a semi-cured product composite containing: a porous body; and a semi-cured product of a thermally curable composition impregnated in the porous body, wherein the thermally curable composition contains an epoxy compound and a cyanate compound, and an equivalent ratio of an epoxy group of the epoxy compound to a cyanate group of the cyanate compound in the thermally curable composition is 1.0 or more.
Epoxy composition
An epoxy composition that includes an epoxy-terminated prepolymer, an alkanolamine hardener having at least one hydroxyl group and an organometallic compound, where amine groups of the alkanolamine hardener react with epoxy groups of the epoxy-terminated prepolymer in a stoichiometric ratio to form a cured epoxy composition. The epoxy-terminated prepolymer is formed from a reaction product of an amine terminated polymeric polyol and a molar excess of epoxy groups in an epoxy monomer, relative to a molar amount of amine groups in the amine terminated polymeric polyol.
ADHESIVE FOR ENDOSCOPE, CURED PRODUCT THEREOF, ENDOSCOPE, AND METHOD FOR MANUFACTURING THE SAME
Provided are an adhesive for an endoscope, a cured product thereof, an endoscope including a member secured with the cured product, and a method for manufacturing the endoscope. The adhesive includes the following (a) to (c): (a) an epoxy resin including at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin; (b) a polyamine compound having an oxygen atom but no amide bond in a molecule thereof; and (c) a metal alkoxide compound.
Formulation and Processing of Degradable High Tg Epoxy Composite that can be degradable at Extremely Low Temperature
The patent application discloses a degradable thermoset composite. The composite comprises a reaction product of an epoxy resin, a cross-linker, a catalyst. The epoxy resin mixture may comprise at least one cycloaliphatic epoxide. The reaction product may have a glass transition temperature greater than or equal to 140° C. as measured by DMA.
Wetting agents and dispersants having rheological character
A polyaddition compound and/or a salt thereof is obtainable by the reaction of epoxy resin based on at least one diglycidyl ether of Formula (I) ##STR00001##
wherein R=a divalent aliphatic or monocyclic aromatic or bicyclic aromatic radical or mixtures thereof; with at least one polyether alcohol of Formula (II)
R.sup.1-[OEt].sub.n-[OPr].sub.m-[OBu].sub.s-[OSO].sub.r-OHFormula (II)
wherein R.sup.1=independently identical or different, linear or branched, optionally aromatic hydrocarbyl radicals having 1 to 18 carbon atoms, [OEt]=ethylene oxide radical, [OPr]=propylene oxide radical, [OBu]=butylene oxide radical, [OSO]=styrene oxide radical, n=0 to 100, m=0 to 50, s=0 to 20, and r=0 to 3, with the proviso that n+m+s+r=3-103, and with at least one compound containing at least one functional group selected from sulfate groups, sulfonate groups, carboxylate groups and phosphate groups.
Ceramic resin composite body
Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 m and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180 C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.
Wetting agents and dispersants having rheological character
A polyaddition compound and/or a salt thereof is obtainable by the reaction of epoxy resin based on at least one diglycidyl ether of Formula (I)
##STR00001##
wherein R=a divalent aliphatic or monocyclic aromatic or bicyclic aromatic radical or mixtures thereof; with at least one polyether alcohol of Formula (II)
R.sup.1-[OEt].sub.n-[OPr].sub.m-[OBu].sub.s-[OSO].sub.r-OHFormula (II)
wherein R.sup.1=independently identical or different, linear or branched, optionally aromatic hydrocarbyl radicals having 1 to 18 carbon atoms, [OEt]=ethylene oxide radical, [OPr]=propylene oxide radical, [OBu]=butylene oxide radical, [OSO]=styrene oxide radical, n=0 to 100, m=0 to 50, s=0 to 20, and r=0 to 3, with the proviso that n+m+s+r=3-103, and with at least one compound containing at least one functional group selected from sulfate groups, sulfonate groups, carboxylate groups and phosphate groups.
EPOXY RESIN WITH IMPROVED WATER RESISTANCE AND COMPOSITION COMPRISING SAME
The present invention relates to an epoxy resin with improved water resistance and a composition comprising same and, more specifically, to: an epoxy resin which is prepared by the reaction of epihalohydrin and a diol component including anhydrosugar alcohol and a diol other than the anhydrosugar alcohol in a specific content ratio, thus exhibiting excellent eco-friendliness and improved water resistance, and, when applied to a coating composition, exhibits an anti-fog effect and at the same time can provide a coating with improved durability against moisture; and a composition comprising the epoxy resin (preferably, an anti-fog coating composition).
Initiators and use thereof for cationic photopolymerization
The invention relates to the use of aryliodonium and/or arylsulfonium salts of the tetrakis(perfluoro-t-butyloxy)aluminate anion of the following formula (I): ##STR00001##
as cationic initiators cleavable by light and/or free radicals for polymerizing cationically polymerizable monomers.
CERAMIC RESIN COMPOSITE BODY
Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 m and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180 C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.