A resin composition is provided which contains a mixture comprising a cycloaliphatic epoxy resin, a coupling agent, and an epoxy-containing compound, and/or a polycarbonate alcohol. Further, the resin composition contains a hardener component comprising a dicarboxylic anhydride, a dicarboxylic anhydride semi ester, an organic phosphite and an accelerator.

An adhesive for an endoscope, the adhesive including an epoxy resin including at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, or phenol novolac epoxy resin, a curing component, and an acidic curing acceleration component; a cured product of the adhesive; an endoscope including the cured product fixed; and a method for producing the endoscope.

A multi-component composition for additive manufacturing, and related methods, are generally described.

This invention relates to a thermally conductive potting composition, comprising a first part comprising at least one epoxy resin; at least one thermally conductive filler; and at least one metal complex; and a second part comprising at least one curing agent. The first part of the thermally conductive potting composition exhibits high thixotropic index and therefore the first part is easily stored. After the first part and the second part is mixed, the thermally conductive potting composition exhibits low thixotropic index and the meets the requirement for potting process.

To prevent gelling even during storage for a long time period under high temperature or room temperature, and to achieve rapid curing under a room-temperature condition at the time of photoirradiation, provided are a photocationically curable composition containing a cationically polymerizable monomer and photoacid generators, and being substantially free of a hydrogen ion scavenger, wherein the photoacid generators include: at least one kind of photoacid generator selected from a photoacid generator formed of an ion pair whose anion is a noncoordinating anion, and a photoacid generator formed of a zwitterionic compound whose anionic moiety is a noncoordinating anionic moiety; and at least one kind of photoacid generator selected from a photoacid generator formed of an ion pair whose anion is not a noncoordinating anion and a photoacid generator formed of a zwitterionic compound whose anionic moiety is not a noncoordinating anionic moiety, and a dental curable composition using the same.

A cationic curing agent includes porous particles and a compound represented by General Formula (1), where the compound is held in the porous particles.

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In the General Formula (1), R.sup.1 is an alkyl group having 1 to 18 carbon atoms or a phenyl group, where the alkyl group may be branched and the alkyl group and the phenyl group may each further have a substituent. R.sup.2 is a hydrogen atom, an alkyl group having 1 to 4 carbon atoms where the alkyl group may be branched, a halogenoalkyl group, an alkoxy group, or a phenoxy group; where the alkyl group, the halogenoalkyl group, the alkoxy group, or the phenoxy group may further have a substituent. R.sup.1 and R.sup.2 may be identical to or different from each other.

Provided are a resin composition, a resin cured product, and a fiber reinforced resin capable of shortening a stress relaxation time. In order to solve this problem, the resin composition contains an epoxy compound having two or more epoxy groups in a molecule, an acid anhydride, and a complex in which an organic ligand is coordinated to manganese (III). The resin cured product contains a resin having an ester group and a hydroxy group, and a complex in which an organic ligand is coordinated to manganese (III). A fiber reinforced resin 101 contains a resin 1 having an ester group and a hydroxy group, fibers 2 impregnated with at least the resin, and a complex 3 in which an organic ligand is coordinated to manganese (III).

Provided are an epoxy resin adhesive for a medical device and its cured product, and a medical device member and a medical device. The epoxy resin adhesive includes the following components (A) to (C): (A) an epoxy resin; (B) a polyamine compound having two or more unsubstituted amino groups; and (C) a compound having a nonaromatic carbon-carbon double bond group and a phenolic hydroxy group.

The disclosure relates to an accelerator composition for the cure of epoxy resins with aromatic amines comprising: (a) a metal complex with carboxylate ligands; and (b) a boron trifluoride amine complex or a boron trifluoride phenol complex. The disclosure also relates to a curing composition for the cure of epoxy resin comprising: (i) an aromatic amine as curing agent; and (ii) the above accelerator composition or, alternatively, a mixture of (1) a metal complex with carboxylate ligands and (2) neat boron trifluoride or boron trifluoride etherate for in-situ formation of a boron trifluoride amine complex with the aromatic amine . Additionally, the disclosure relates to the use of such compositions and to a cured resin product obtainable from the use of such compositions.

The present invention provides compositions consisting of a) at least one metal salt, ammonium salt or phosphonium salt of a strong Brønsted acid and b) at least one primary aliphatic monoamine, processes for preparation thereof and use thereof.