C08G59/685

CATALYTIC SYSTEMS FOR THERMOSETTING RESINS WHICH ARE DEFORMABLE IN THE THERMOSET STATE

The invention relates to a composition containing at least one catalyst (C1) containing at least one atom of an element (M1) chosen from: Al, Sc, Ti, Mg, Mn, Fe, Co, Ni, Cu, Zn, Zr, Sn, Hf, Pb, Si, Sb and In; a catalyst (C2) comprising at least one atom of an element (M2) chosen from alkali metals and alkaline-earth metals; a thermosetting resin and/or a hardener for a thermosetting resin. The invention also relates to the use of this composition for rendering a resin which is in the thermoset state hot-deformable and nevertheless free of any residual stress after the deformation thereof; such a resin will advantageously retain its shape even if it is subsequently subjected to high temperatures. The invention relates, moreover, to kits for preparing the composition, to a thermoset-resin-based object obtained from a composition of the invention, to a process for manufacturing objects, to a process for hot-deformation of objects and to various possible uses of the compositions and objects of the invention.

EPOXY BASED THERMAL INTERFACE MATERIAL

Disclosed herein are thermal interface material comprising liquid epoxy resin that is free of aromatic groups and high loading of aluminum trihydroxide and the use thereof in battery powered vehicles.

Latent curing accelerators

A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH.sub.2—CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR.sub.1—, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.

FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND METHOD FOR MANUFACTURING THE MOUNTING STRUCTURE

A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.

HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE USING SAME
20170283609 · 2017-10-05 ·

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

ACCELERATOR COMPOSITION
20170247503 · 2017-08-31 ·

An accelerator composition for epoxy resin formulations, the accelerator composition including (i) at least one transition metal complex and (ii) at least one salt where the cation of the salt is a metal or an onium cation with a non-nucleophilic anion; and a curable epoxy resin composition including (A) at least one epoxy thermosetting resin, (B) at least one curing agent, and (C) the above accelerator; a curable epoxy resin composition containing the above accelerator; and a cured thermoset produced from the above curable epoxy resin composition.

Curable Epoxy Composition Including Accelerator
20170247502 · 2017-08-31 ·

A curable composition includes an epoxy resin component that includes at least one multifunctional epoxy novolac resin and at least one multifunctional liquid epoxy resin, an amine hardener component that includes at least one aromatic amine and optionally at least one cycloaliphatic amine, and an accelerator component that includes (i) at least one transition metal complex having a transition metal ion and an oxygen donor ligand, and (ii) at least one salt having a cation including a metal ion or an onium ion, and an anion including a non-nucleophilic anion.

MODIFIER FOR CURABLE COMPOSITIONS COMPRISING BENZYL ALCOHOL ALKOXYLATES

The present invention relates to a modifier comprising benzyl alcohol-based alkoxylates for curable compositions comprising at least one epoxy resin and a hardener, which are obtained by reacting benzyl alcohol with alkylene oxides, the benzyl alcohol-based alkoxylates having at least one ethoxy fragment.

Compositions consisting of BrØnsted acids and monoamines

The present invention provides compositions consisting of a) at least one metal salt, ammonium salt or phosphonium salt of a strong Brønsted acid and b) at least one primary aliphatic monoamine, processes for preparation thereof and use thereof.

Epoxy composition

An epoxy composition that includes an epoxy-terminated prepolymer, an alkanolamine hardener having at least one hydroxyl group and an organometallic compound, where amine groups of the alkanolamine hardener react with epoxy groups of the epoxy-terminated prepolymer in a stoichiometric ratio to form a cured epoxy composition. The epoxy-terminated prepolymer is formed from a reaction product of an amine terminated polymeric polyol and a molar excess of epoxy groups in an epoxy monomer, relative to a molar amount of amine groups in the amine terminated polymeric polyol.