The present disclosure provides heat-curable coating compositions for optical articles. The coating compositions include a multifunctional epoxy monomer in combination with a UV absorber. The inclusion of at least one multifunctional epoxy monomer and at least one UV absorber provide epoxy coatings that exhibit excellent adhesion on a variety of lens substrates.

The present disclosure provides heat-curable coating compositions for optical articles. The coating compositions include a multifunctional epoxy monomer in combination with a UV absorber. The inclusion of at least one multifunctional epoxy monomer and at least one UV absorber provide epoxy coatings that exhibit excellent adhesion on a variety of lens substrates.

The host compound in a clathrate is an amino or hydroxyl containing aromatic phosphorous compound, clathrates containing a resin curative and their use in curable resin compositions to produce moulded articles particularly fibre reinforced articles.

Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.

An impregnating resin, e.g., a catalytically hardenable impregnating resin for the conductor of an electrical machine, may include at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, e.g., for cationic, anionic or coordinate polymerization of the impregnating resin. The properties of the impregnating resin or use thereof may be improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin may be part of a main insulation of a conductor arrangement, which may in turn be installed in an electrical coil or other electrical machine.

An aluminum chelate-based latent curing agent for curing a thermosetting epoxy resin, in which an aluminum chelate-based curing agent is held in a porous resin obtained by, at the same time, subjecting a polyfunctional isocyanate compound to interfacial polymerization and subjecting a radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator, and the surface of the aluminum chelate-based latent curing agent has been subjected to inactivation treatment with an alkoxysilane coupling agent. An alkylalkoxysilane is preferred as the alkoxysilane coupling agent. The radical polymerizable compound preferably contains a polyfunctional radical polymerizable compound.

An aluminum chelate-based latent curing agent for curing a thermosetting epoxy resin, in which an aluminum chelate-based curing agent is held in a porous resin obtained by, at the same time, subjecting a polyfunctional isocyanate compound to interfacial polymerization and subjecting a radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator, and the surface of the aluminum chelate-based latent curing agent has been subjected to inactivation treatment with an alkoxysilane coupling agent. An alkylalkoxysilane is preferred as the alkoxysilane coupling agent. The radical polymerizable compound preferably contains a polyfunctional radical polymerizable compound.

According to an embodiment, a thermosetting epoxy resin composition including an epoxy resin, an aromatic amine compound, a boron-phosphorus complex, and a phosphorus compound is provided. The aromatic amine compound is represented by the following general formula (1) (where R.sub.1 represents an alkyl group, m represents an integer of 2 or more, n represents an integer of 0 or more, and m and n satisfy m+n≤6, and when n is an integer of 2 or more, a plurality of R.sub.1 may be the same as or different from each other).

##STR00001##

The present invention relates to a heat-curable composition comprising at least one epoxy monomer having two or three epoxy groups, which is not a silicon compound having at least one hydrolyzable group directly linked to the silicon atom, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one group comprising an epoxy function linked to the silicon atom though a carbon atom, and/or a hydrolyzate thereof, at least one epoxy ring-opening catalyst, and at least one compound comprising at least two (2,2,6,6-tetramethyl-4-piperidyl)-groups in which the nitrogen atom can be substituted with an alkyl group, an alkoxy group or an oxyl group.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer having two or three epoxy groups, which is not a silicon compound having at least one hydrolyzable group directly linked to the silicon atom, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one group comprising an epoxy function linked to the silicon atom though a carbon atom, and/or a hydrolyzate thereof, at least one epoxy ring-opening catalyst, and at least one compound comprising at least two (2,2,6,6-tetramethyl-4-piperidyl)-groups in which the nitrogen atom can be substituted with an alkyl group, an alkoxy group or an oxyl group.