The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.

The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.

A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH.sub.2—CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR.sub.1—, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.

A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH.sub.2—CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR.sub.1—, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.

An accelerator composition for epoxy resin formulations, the accelerator composition including (i) at least one transition metal complex and (ii) at least one salt where the cation of the salt is a metal or an onium cation with a non-nucleophilic anion; and a curable epoxy resin composition including (A) at least one epoxy thermosetting resin, (B) at least one curing agent, and (C) the above accelerator; a curable epoxy resin composition containing the above accelerator; and a cured thermoset produced from the above curable epoxy resin composition.

An accelerator composition for epoxy resin formulations, the accelerator composition including (i) at least one transition metal complex and (ii) at least one salt where the cation of the salt is a metal or an onium cation with a non-nucleophilic anion; and a curable epoxy resin composition including (A) at least one epoxy thermosetting resin, (B) at least one curing agent, and (C) the above accelerator; a curable epoxy resin composition containing the above accelerator; and a cured thermoset produced from the above curable epoxy resin composition.

A curable composition includes an epoxy resin component that includes at least one multifunctional epoxy novolac resin and at least one multifunctional liquid epoxy resin, an amine hardener component that includes at least one aromatic amine and optionally at least one cycloaliphatic amine, and an accelerator component that includes (i) at least one transition metal complex having a transition metal ion and an oxygen donor ligand, and (ii) at least one salt having a cation including a metal ion or an onium ion, and an anion including a non-nucleophilic anion.

A curable composition includes an epoxy resin component that includes at least one multifunctional epoxy novolac resin and at least one multifunctional liquid epoxy resin, an amine hardener component that includes at least one aromatic amine and optionally at least one cycloaliphatic amine, and an accelerator component that includes (i) at least one transition metal complex having a transition metal ion and an oxygen donor ligand, and (ii) at least one salt having a cation including a metal ion or an onium ion, and an anion including a non-nucleophilic anion.

The present invention provides compositions consisting of a) at least one metal salt, ammonium salt or phosphonium salt of a strong Brønsted acid and b) at least one primary aliphatic monoamine, processes for preparation thereof and use thereof.

Provided is a curable composition which has excellent thin-film curability and which can form, via the application of light and/or heat, a cured product having heat resistance and thermal yellowing resistance at excellent levels. This curable composition contains cationically curable compounds and a cationic-polymerization initiator. The cationically curable compounds include an epoxy compound (A) in an amount of 10 to 90 weight percent of the total weight of the cationically curable compounds, and an oxetane compound (B) in an amount of 5 to 40 weight percent of the total weight of the cationically curable compounds. The cationic-polymerization initiator includes an onium borate salt (C). The onium borate salt (C) preferably has an anionic moiety selected from [(C.sub.6H.sub.5)B(C.sub.6F.sub.5).sub.3].sup.−, [(C.sub.6H.sub.5)B((CF.sub.3CF.sub.2).sub.2C.sub.6H.sub.2F).sub.3].sup.−, and [(C.sub.6H.sub.5C.sub.6H.sub.4)B(C.sub.6F.sub.5).sub.3].sup.− and a cationic moiety selected from arylsulfonium ions.