Patent classifications
C08G63/189
Polyester composition, polyester film, and magnetic recording medium
The invention provides a polyester composition in which the primary repeating units contain an aromatic dicarboxylic acid component (Component A) and an ethylene glycol component (Component C) and a long-chain alkyl dicarboxylic acid component having not less than 6 carbons (Component B) or a long-chain alkyl diol component having not less than 6 carbons (Component D), wherein a sum (WB+WD) of a relative amount (WB) of Component B as calculated based on a total number of moles of Component A and Component B plus a relative amount (WD) of Component D as calculated based on a total number of moles of Component C and Component D are within a range of 2-13 mol %. The invention also provides a polyester film prepared from the polyester composition and having excellent dimensional stability, as well as a magnetic recording medium utilizing the polyester film.
Polyester composition, polyester film, and magnetic recording medium
The invention provides a polyester composition in which the primary repeating units contain an aromatic dicarboxylic acid component (Component A) and an ethylene glycol component (Component C) and a long-chain alkyl dicarboxylic acid component having not less than 6 carbons (Component B) or a long-chain alkyl diol component having not less than 6 carbons (Component D), wherein a sum (WB+WD) of a relative amount (WB) of Component B as calculated based on a total number of moles of Component A and Component B plus a relative amount (WD) of Component D as calculated based on a total number of moles of Component C and Component D are within a range of 2-13 mol %. The invention also provides a polyester film prepared from the polyester composition and having excellent dimensional stability, as well as a magnetic recording medium utilizing the polyester film.
COMPOSITION FOR RESIN RAW MATERIAL
In order to improve resin physical properties such as heat resistance (glass transition temperature) of a resin such as polyester obtained from 2,2′-bis(carboxymethoxy)-1,1′-binaphthyl, provided is a composition for a resin raw material containing a compound represented by formula (1) as a component A and a compound represented by formula (2) as a component B, wherein their composition ratios are in ranges wherein the component A is present in an amount of 98.0 area % or more and 99.99 area % or less, and the component B is present in an amount of 1.50 area % or less, relative to the total amount of all components detected at a wavelength of 280 nm by high-performance liquid chromatography analysis using a UV detector.
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Thermoplastic resin composition
A thermoplastic resin composition includes a first copolymer including a conjugated diene-based polymer, a unit derived from an aromatic vinyl-based monomer, and a unit derived from a vinyl cyan-based monomer; a second copolymer including a unit derived from an aromatic vinyl-based monomer and a unit derived from a vinyl cyan-based monomer; and, with respect to 100 parts by weight of the sum of the first copolymer and the second copolymer, 2.0 to 10 parts by weight of a third copolymer having a soft segment including a unit derived from a polyalkylene glycol and a hard segment including unit derived from an aromatic dicarboxylic acid or aromatic dicarboxylate and a unit derived from a linear aliphatic diol; and 2.5 to 10 parts by weight of a fourth copolymer including an aromatic dicarboxylic acid-derived unit, a unit derived from a linear aliphatic diol, and a unit derived from a cyclic aliphatic diol.
Thermoplastic resin composition
A thermoplastic resin composition includes a first copolymer including a conjugated diene-based polymer, a unit derived from an aromatic vinyl-based monomer, and a unit derived from a vinyl cyan-based monomer; a second copolymer including a unit derived from an aromatic vinyl-based monomer and a unit derived from a vinyl cyan-based monomer; and, with respect to 100 parts by weight of the sum of the first copolymer and the second copolymer, 2.0 to 10 parts by weight of a third copolymer having a soft segment including a unit derived from a polyalkylene glycol and a hard segment including unit derived from an aromatic dicarboxylic acid or aromatic dicarboxylate and a unit derived from a linear aliphatic diol; and 2.5 to 10 parts by weight of a fourth copolymer including an aromatic dicarboxylic acid-derived unit, a unit derived from a linear aliphatic diol, and a unit derived from a cyclic aliphatic diol.
Method for manufacturing thermoplastic resin composition
A method for manufacturing a thermoplastic resin composition enabling easy control of the weight average molecular weight of a thermoplastic resin used in a soluble three-dimensional modeling support material, the support material having sufficient strength even when used in the manufacture of a three-dimensional object by an FDM system 3D printer, being less colored with excellent appearance quality, and having a high dissolution speed in neutral water and quickly removable from a precursor of the three-dimensional object without using a strong alkaline aqueous solution; and the thermoplastic resin having dicarboxylic acid monomer units derived from a dicarboxylic acid component and having a proportion of an aromatic dicarboxylic acid monomer unit derived from a sulfonic acid group and/or sulfonate group-containing aromatic dicarboxylic acid component in the dicarboxylic acid monomer units of 10 mol % or more; the method including mixing an organic salt compound represented by formula (I):
(R.sup.1—SO.sub.3.sup.−).sub.nX.sup.n+ (I).
LIQUID CRYSTAL POLYESTER RESIN, LIQUID CRYSTAL POLYESTER RESIN COMPOSITION, FORMED PRODUCT, LAYERED BODY AND LIQUID CRYSTAL POLYESTER RESIN FILM, AND PRODUCTION METHOD THEREFOR
A liquid crystal polyester resin comprising 42 to 80 mol % of structural unit (I) relative to 100 mol % of the total structural unit of the liquid crystal polyester resin, and ΔS (entropy of melting) defined by equation [1] is 0.01×10.sup.−3 to 2.7×10.sup.−3 J/g.Math.K:
ΔS(J/g.Math.K)=ΔHm(J/g)/Tm(K) [1]
wherein Tm is an endothermic peak temperature determined by: after observation of an endothermic peak temperature (Tm.sub.1) observed when heating a liquid crystal polyester under temperature rising conditions of 20° C./minute from room temperature in differential scanning calorimetry, the liquid crystal polyester was maintained at a temperature of Tm.sub.1+20° C. for 5 minutes, followed by observation of the endothermic peak temperature observed when the temperature has fallen to room temperature under temperature falling conditions of 20° C./minute and then raised under temperature rising conditions of 20° C./minute, and ΔHm is an endothermic peak area of Tm:
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WATER-SOLUBLE RESIN FOR PRINTING
The water-soluble resin for printing of the present invention includes a monomer unit A having a sulfonate group; and a monomer unit B having no hydrophilic group, and a percentage of the monomer unit A based on a total of all monomer units is 5 to 35 mol %. According to the water-soluble resin for printing of the present invention, a printed matter from which a printing layer can be safely and efficiently removed with neutral water and which is excellent in water resistance can be realized.
Polymer Composition for Use in an Electronic Device
A polymer composition is disclosed that comprises a dielectric filler distributed within a polymer matrix containing at least one thermotropic liquid crystalline polymer is provided. The polymer composition exhibits a dissipation factor of about 0.01 or less as determined at a frequency of 2 GHz and a dielectric constant of about 6 or more as determined at a frequency of 2 GHz.
Polymer Composition for Use in an Electronic Device
A polymer composition is disclosed that comprises a dielectric filler distributed within a polymer matrix containing at least one thermotropic liquid crystalline polymer is provided. The polymer composition exhibits a dissipation factor of about 0.01 or less as determined at a frequency of 2 GHz and a dielectric constant of about 6 or more as determined at a frequency of 2 GHz.