The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments comprising a polymer composition, said polymer composition comprising: a) about 5 wt. % to about 60 wt. % of a thermoplastic polymer A having a melting peak temperature greater than 40° C.; b) about 95 wt. % to about 40 wt. % of a thermoplastic polymer B having a melting peak temperature greater than 20° C.; c) optionally from about 0.1 to 3 wt. % of a viscosity modifier; wherein: the melting peak temperature of thermoplastic polymer A is at least 20° C. greater than the melting peak temperature of thermoplastic polymer B; thermoplastic polymer A is dispersed in thermoplastic polymer B; and the polymer composition has a melt index of at least 0.1 g/10 minutes using a 10 kg weight measured according to ASTM D1238-13 at a temperature which is less than the melting peak temperature of thermoplastic polymer A and which is greater than the melting peak temperature of thermoplastic polymer B.

The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments comprising a polymer composition, said polymer composition comprising: a) about 5 wt. % to about 60 wt. % of a thermoplastic polymer A having a melting peak temperature greater than 40° C.; b) about 95 wt. % to about 40 wt. % of a thermoplastic polymer B having a melting peak temperature greater than 20° C.; c) optionally from about 0.1 to 3 wt. % of a viscosity modifier; wherein: the melting peak temperature of thermoplastic polymer A is at least 20° C. greater than the melting peak temperature of thermoplastic polymer B; thermoplastic polymer A is dispersed in thermoplastic polymer B; and the polymer composition has a melt index of at least 0.1 g/10 minutes using a 10 kg weight measured according to ASTM D1238-13 at a temperature which is less than the melting peak temperature of thermoplastic polymer A and which is greater than the melting peak temperature of thermoplastic polymer B.

The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments comprising a polymer composition, said polymer composition comprising: a) about 5 wt. % to about 60 wt. % of a thermoplastic polymer A having a melting peak temperature greater than 40° C.; b) about 95 wt. % to about 40 wt. % of a thermoplastic polymer B having a melting peak temperature greater than 20° C.; c) optionally from about 0.1 to 3 wt. % of a viscosity modifier; wherein: the melting peak temperature of thermoplastic polymer A is at least 20° C. greater than the melting peak temperature of thermoplastic polymer B; thermoplastic polymer A is dispersed in thermoplastic polymer B; and the polymer composition has a melt index of at least 0.1 g/10 minutes using a 10 kg weight measured according to ASTM D1238-13 at a temperature which is less than the melting peak temperature of thermoplastic polymer A and which is greater than the melting peak temperature of thermoplastic polymer B.

A polymerizable composition, a prepolymer, a phthalonitrile resin, or a composite provided herein has excellent heat resistance and does not cause defects that may adversely affect physical properties. In addition, the polymerizable composition exhibits appropriate curing properties, processing temperatures and process windows and to be capable of forming a composite of excellent physical properties.

A polymerizable composition, a prepolymer, a phthalonitrile resin, or a composite provided herein has excellent heat resistance and does not cause defects that may adversely affect physical properties. In addition, the polymerizable composition exhibits appropriate curing properties, processing temperatures and process windows and to be capable of forming a composite of excellent physical properties.

A polymerizable composition, a prepolymer, a phthalonitrile resin, or a composite provided herein has excellent heat resistance and does not cause defects that may adversely affect physical properties. In addition, the polymerizable composition exhibits appropriate curing properties, processing temperatures and process windows and to be capable of forming a composite of excellent physical properties.

A polymerizable composition, a prepolymer, a phthalonitrile resin, or a composite provided herein has excellent heat resistance and does not cause defects that may adversely affect physical properties. In addition, the polymerizable composition exhibits appropriate curing properties, processing temperatures and process windows and to be capable of forming a composite of excellent physical properties.