Patent classifications
C08G73/0286
COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A POLYAMINOAMIDE TYPE LEVELING AGENT
Described herein is a composition including copper ions, an acid, and at least one polyaminoamide including, a group of formula L1
[A-B-A′-Z].sub.n[Y—Z].sub.m (L1)
where
B is a diacid fragment of formula L2
##STR00001##
A, A′ are amine fragments independently selected from the group consisting of formula L3a
##STR00002## and formula L3b
##STR00003##
Y is a co-monomer fragment;
Z is a coupling fragment of formula L4
##STR00004##
n is an integer of from 1 to 400; and
m is 0 or an integer of from 1 to 400.
PROCESS FOR MANUFACTURING WET STRENGTH RESINS
The invention relates to a process for manufacturing wet strength resins, which process comprises a polyamide reactor (11) for amidation, an EHH reactor (12) for epihalohydrin addition, a maturing tank (15) for maturing, a ring-closure and cross-linking reactor (16) for polymerization, and in the process a reaction mixture containing at least EHH and at least polyaminoamide epihalohydrin adduct is manufactured. The process further comprises between the maturing tank (15) and the ring-closure and cross-linking reactor (16) a membrane unit (20) comprising a membrane by dividing the reaction mixture stream from the membrane unit (20) into two streams: a permeate stream (202) comprising un-reacted epi-halohydrin and a reject stream (201) comprising EHH/PAIM adduct guided to the ring-closure and cross-linking reactor (16).
COATING COMPOSITIONS FOR USE IN CREPED PAPER PRODUCT MANUFACTURING AND METHODS FOR PRODUCING THE SAME
A method for preparing an adhesive resin for use in a coating composition for a crepe paper manufacturing process that includes the steps of reacting a polycarboxylic acid or a derivative of a polycarboxylic acid with a polyamine to form a polyamidoamine intermediate; reacting a polyetheramine with an epihalohydrin to form a polyetheramine-epihalohydrin intermediate and reacting the polyamidoamine intermediate with the polyetheramine-epihalohydrin intermediate to form a polyamidoamine polyetheramine-epihalohydrin resin.
Process to improve performance of wet-strength resins through base activation
Provided is a process for improving the performance of wet-strength resins, such as polyaminopolyamide-epichlorohydrin resins, by treatment with a base to increase molecular weight to provide improved wet strength.
CREPING ADHESIVES AND PROCESSES FOR MAKING AND USING SAME
Creping adhesives and processes for making and using same. In some embodiments, the creping adhesive can include a solvent, a modified polyvinyl alcohol, and a crosslinked resin. The crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties and propanediyl moieties, where the primary crosslinking moieties can be derived from a functionally symmetric crosslinker. In other embodiments, the crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties and secondary crosslinking moieties, where the primary crosslinking moieties can be derived from a first functionally symmetric crosslinker and the secondary crosslinking moieties can be derived from a second functionally symmetric crosslinker. In other embodiments, the crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties, where the primary crosslinking moieties can be derived from a functionally symmetric crosslinker. The modified polyvinyl alcohol can include a carboxylated, a sulfonated, a sulfated, and/or a sulfonated-carboxylated polyvinyl alcohol.
Wood adhesive, method for adhering wood materials using the same, and composite wood structure using the same
A wood adhesive, a method for adhering wood materials using the same, and a composite wood structure using the same are disclosed. The wood adhesive comprises a first agent and a second agent, wherein the first agent comprises sodium carboxymethyl cellulose having a molecular weight from about 15,000 to about 500,000 and a degree of substitution from about 0.4 to about 2, and the second agent comprises polymeric quaternary amine.
Method for modifying surface of non-conductive substrate and sidewall of micro/nano hole with rGO
Non-conductive substrates, especially the sidewalls of micro/nano holes thereof are chemically modified (i.e., chemically grafted) by reduced graphene oxide (rGO). The rGO possesses excellent electrical conductivity and therefore the modified substrates become conductive, so that it can be directly electroplated. These rGO-grafted holes can pass thermal shock reliability test after electroplating. The rGO grafting process possesses many advantages, such as a short process time, no complex agent (i.e., no chelator), no toxic agents (i.e., formaldehyde for electroless Cu deposition). It is employed in an aqueous solution instead of an organic solvent, and therefore is environmentally friendly and beneficial for industrial production.
Creping adhesives containing functionalized crosslinked resins
Creping adhesives can include one or more crosslinked resins having the chemical formula (O), (P), or (Q), where R.sup.X can be a crosslinking moiety, each R.sup.Y can independently be a substituted or unsubstituted organic diyl moiety, and each A.sup. can independently be an anion. The creping adhesive can have a cylinder probe adhesion of about 100 gram-force to about 300 gram-force. The creping adhesive can have a peel adhesion of about 20 g/cm to about 110 g/cm.
Creping adhesives and processes for making and using same
Creping adhesives and processes for making and using same. In some embodiments, the creping adhesive can include a solvent, a modified polyvinyl alcohol, and a crosslinked resin. The crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties and propanediyl moieties, where the primary crosslinking moieties can be derived from a functionally symmetric crosslinker. In other embodiments, the crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties and secondary crosslinking moieties, where the primary crosslinking moieties can be derived from a first functionally symmetric crosslinker and the secondary crosslinking moieties can be derived from a second functionally symmetric crosslinker. In other embodiments, the crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties, where the primary crosslinking moieties can be derived from a functionally symmetric crosslinker. The modified polyvinyl alcohol can include a carboxylated, a sulfonated, a sulfated, and/or a sulfonated-carboxylated polyvinyl alcohol.
CREPING ADHESIVES AND PROCESSES FOR MAKING AND USING SAME
Creping adhesives and processes for making and using same. In some embodiments, the creping adhesive can include a solvent, a modified polyvinyl alcohol, and a crosslinked resin. The crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties and propanediyl moieties, where the primary crosslinking moieties can be derived from a functionally symmetric crosslinker In other embodiments, the crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties and secondary crosslinking moieties, where the primary crosslinking moieties can be derived from a first functionally symmetric crosslinker and the secondary crosslinking moieties can be derived from a second functionally symmetric crosslinker In other embodiments, the crosslinked resin can include polyamidoamine backbones crosslinked by primary crosslinking moieties, where the primary crosslinking moieties can be derived from a functionally symmetric crosslinker The modified polyvinyl alcohol can include a carboxylated, a sulfonated, a sulfated, and/or a sulfonated-carboxylated polyvinyl alcohol.