Patent classifications
C08G73/0627
Mechanochemical based synthesis of perfluoropyridine monomers for polymerization
The present invention relates to a mechanochemical based synthesis of perfluoropyridine monomers, polymers made using such monomers and methods of making and using articles comprising such polymers. Such perfluoropyridine monomers are easily chemically tuned have the strength needed for high temperature applications and the flexibility needed for low temperature applications. In addition, to the aforementioned monomers, a mechanochemical based synthesis for such perfluoropyridine monomers is provided. All of the aforementioned performance application advantages are also found in polymers comprising Applicants' perfluoropyridine monomers.
Copper deposition in wafer level packaging of integrated circuits
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.
Organic thin film including semiconducting polymer and elastomer configured to be dynamic intermolecular bonded with a metal-coordination bond and organic sensor and electronic device including the same
Disclosed are an organic thin film including a semiconducting polymer including a ligand that is metal-coordination bondable or is metal-coordination bonded and an elastomer including a ligand that is metal-coordination bondable or is metal-coordination bonded, wherein the semiconducting polymer and the elastomer are configured to be dynamic intermolecular bonded by a metal-coordination bond, an organic sensor, and an electronic device.
ANION EXCHANGE POLYMERS AND MEMBRANES FOR ELECTROLYSIS
Anion exchange polymers having high OH.sup.− conductivity, chemical stability, and mechanical stability have been developed for use in AEMs. The anion exchange polymers have stable hydrophobic polymer backbones, stable hydrophilic quaternary ammonium cationic groups, and hydrophilic phenolic hydroxyl groups on the polymer side chains. The polymers have polymer backbones free of ether bonds, hydrophilic polymer side chains, and piperidinium ion-conducting functionality, which enables efficient and stable operation in water or CO.sub.2 electrolysis, redox flow battery, and fuel cell applications. The polymer comprises a plurality of repeating units of formula (I)
##STR00001##
Anion exchange membranes and membrane electrode assemblies incorporating the anion exchange polymers are also described.
METHOD FOR THE SYNTHESIS OF A TWO-DIMENSIONAL OR QUASI-TWO-DIMENSIONAL POLYMER FILM, THE TWO-DIMENSIONAL OR QUASI-TWO-DIMENSIONAL POLYMER FILM AND THE USE
The present invention relates to a method for the synthesis of a two-dimensional or quasi-two-dimensional polymer comprising a surfactant, the two-dimensional or quasi-two-dimensional polymer film and the use for the production of membranes, electronic devices or catalysts.
Mechanochemical based synthesis of perfluoropyridine monomers for polymerization
The present invention relates to a mechanochemical based synthesis of perfluoropyridine monomers, polymers made using such monomers and methods of making and using articles comprising such polymers. Such perfluoropyridine monomers are easily chemically tuned have the strength needed for high temperature applications and the flexibility needed for low temperature applications. In addition, to the aforementioned monomers, a mechanochemical based synthesis for such perfluoropyridine monomers is provided. All of the aforementioned performance application advantages are also found in polymers comprising Applicants' perfluoropyridine monomers.
Mechanochemical Based Synthesis of Perfluoropyridine Monomers for Polymerization
The present invention relates to a mechanochemical based synthesis of perfluoropyridine monomers, polymers made using such monomers and methods of making and using articles comprising such polymers. Such perfluoropyridine monomers are easily chemically tuned have the strength needed for high temperature applications and the flexibility needed for low temperature applications. In addition, to the aforementioned monomers, a mechanochemical based synthesis for such perfluoropyridine monomers is provided. All of the aforementioned performance application advantages are also found in polymers comprising Applicants' perfluoropyridine monomers.
POLYMERS, SUBSTRATES, METHODS FOR MAKING SUCH, AND DEVICES COMPRISING THE SAME
The present invention relates generally to substrates for making polymers and methods for making polymers. The present invention also relates generally to polymers and devices comprising the same.
METHOD FOR PRODUCING POLYGUANIDINES
A method for preparing polycondensation products of guanidine, aminoguanidine or diaminoguanidine G with one or more benzyl or allyl derivatives BA according to the following reaction scheme is provided:
##STR00001##
wherein X, R.sub.1, Gua, Y and Z are as defined in the specification. In the disclosed method, at least one benzyl or allyl derivative BA is subjected to a polycondensation reaction with excessive guanidine, aminoguanidine or diaminoguanidine G upon elimination of HX.
Copper Deposition in Wafer Level Packaging of Integrated Circuits
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.