The present invention relates to a phenyl-derivative compound substituted with at least two electron acceptors and at least two electron donors. Formula (I) R.sup.AaR.sup.DbR.sup.ScC.sub.6 wherein a is 2, 3 or 4; b is 2, 3 or 4; c is 0, 1 or 2; a+b−c=6; R.sup.A is at each occurrence independently a group with −M-effect; R.sup.B is at each occurrence independently a group with +−M-effect; R.sup.S is as defined in claim 1. Said compound is suited for use in organic electronic devices, particularly in organic electroluminescent devices.

A conjugated azopolymer and methods for making same. The azopolymer includes a plurality of monomer units containing isoindigo with R.sup.1 and R.sup.2 substituent groups, wherein R.sup.1 can be one or more C1 to 30 hydrocarbons; and R.sup.2 can be H or F. The azopolymer can have a number average molecular weight (M.sub.n) of 4 to 20 kDa; a weight average molecular weight (M.sub.w) of 12 to 50 kDa; and a poly dispersity index (PDI) of 2 to 3. The polymer can further have selected maximal wavelengths (λ.sub.max) of 481 to 709 nm and electrochemical reduction events of −0.4 to −1.0 V against an Ag/AgCl reference electrode.

The present disclosure provides a polymerizable thermosetting composition comprising an acetylene-bearing benzoxazine compound and a phthalonitrile monomer. The composition can provide a low viscosity for RTM application and can fully cured at a much lower temperature than the phthalonitrile monomer. The cured thermoset polymers having excellent thermal and mechanical properties, such as high thermal stability, heat resistance, high char yield, and enhanced structural rigidity.

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate, and a material for forming an organic film containing the compound. A material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, ##STR00001## noting that in the general formula (1B), when W.sub.1 represents ##STR00002##  R.sub.1 does not represent any of ##STR00003##

Carbon phosphonitride (CPN) including tricyanophosphine (P(CN).sub.3), its pre-polymer (CPN-PP), and/or solid CPN (C.sub.3N.sub.3P) can serve as a useful additive for thermoset resins, resulting in improved thermal and mechanical properties.

Provided is an anti-reflective hardmask composition including: (a) a polymer composed of an indolocarbazole represented by the following Chemical Formula 1 or a polymeric blend containing the same; and (b) an organic solvent. ##STR00001##

Disclosed are adhesives comprising a first compound comprising three or more 1,2-dihydroxybenzene groups; and a second compound that is a functionalized polymer; wherein the first compound and second compound are in the form of a mixture, and wherein the adhesive has adhesive properties when wet. Additional embodiments to methods of preparing an adhesive, adhesives prepared by the method, and articles prepared from the adhesive are disclosed.

This disclosure relates to a multilayer structure containing: a substrate; a coupling layer deposited on the substrate; and a dielectric layer deposited on the coupling layer, wherein shear strength is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer in the absence of the coupling layer.

A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1) as a repeating unit, and an organic solvent. Each of AR1 and AR2 represents a benzene ring or naphthalene ring which optionally have a substituent; W.sub.1 represents a particular partial structure having a triple bond, and the polymer optionally contains two or more kinds of W.sub.1; and W.sub.2 represents a divalent organic group having 6 to 80 carbon atoms and at least one aromatic ring. This invention provides: a polymer curable even under film formation conditions in an inert gas and capable of forming an organic film which has not only excellent heat resistance and properties of filling and planarizing a pattern formed in a substrate, but also favorable film formability onto a substrate with less sublimation product; and a composition for forming an organic film, containing the polymer. ##STR00001##

The present disclosure provides a polymerizable composition. The polymerizable composition includes a phthalonitrile resin, a curative, and a polyoxometalate of Formula I: H.sub.n[XM.sub.12O.sub.40] (I). In Formula (I), M is W or Mo, n is 1 to 6, and X is a heteroatom selected from P, Si, S, Ge, As, Te, or Se. The present disclosure also provides an article. The article includes a polymerization product of the polymerizable composition. Additionally, a method is provided. The method includes mixing a polyoxometalate of Formula I with at least one of a curative or phthalonitrile resin and mixing at least a portion of the curative with at least a portion of the phthalonitrile, thereby forming a polymerizable composition. The method further comprises subjecting the polymerizable composition to a temperature of 180° C. to 250° C., to form an at least partially polymerized article and subjecting the at least partially polymerized article to a temperature of 300° C. to 350° C. to complete polymerization of the article.