A polyimide film, a method of manufacturing the same, and a flexible metal foil clad laminate including the same. The polyimide film includes: a first imide bond unit having a glass transition temperature of 400° C. or higher; and a second imide bond unit having a glass transition temperature of less than 400° C., wherein the first imide bond unit is present in an amount of about 39 mol% to about 90 mol% in the polyimide film.

A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.

A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

A polyetherimide composition comprises: a polyetherimide; and an organophosphorus stabilizer present in an amount effective to provide greater than 0.01 ppm to less than 20 ppm, preferably greater than 0.01 ppm to less than 10 ppm, and more preferably greater than 0.01 ppm to less than 4.8 ppm of phosphorus based on the total weight of the polyetherimide composition, the organophosphorus stabilizer having a molecular weight of 300 to 2,000 Daltons and a phosphorus content of 1 to 15 wt %; wherein a molded sample of the polyetherimide composition has a UL 94 V0 rating at a thickness of 1.5 mm.

The present invention provides an amide acid oligomer which has specific composition and which is capable of providing a cured product having excellent physical properties, in particular, an excellent glass transition temperature, etc.

There is provided herein a resin composition comprising:

(i) a silane coupling agent of the general formula (I):

##STR00001##

as described herein, and

(ii) at least one resin which is interactive with one or more of the R.sup.1, R.sup.2 and X groups of silane coupling agent (i).

There is provided herein a resin composition comprising:

(i) a silane coupling agent of the general formula (I):

##STR00001##

as described herein, and

(ii) at least one resin which is interactive with one or more of the R.sup.1, R.sup.2 and X groups of silane coupling agent (i).

Provided is a photocurable maleimide resin composition that is superior in curability, and is capable of being turned into a cured product having superior dielectric properties, a high glass-transition temperature and a small coefficient of thermal expansion. The photocurable maleimide resin composition contains: (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms; and (B) a photocuring initiator.