Disclosed herein is a silicone-modified polyimide resin composition of solvent free type. The composition is suitable for use as an adhesive and a coating material which are capable of hardening upon irradiation with ultraviolet rays and/or visible rays. Also, it is saved from drooling even in the case of light filling with an inorganic compound and it is saved from bubble entrapment and nonuniformity at the time of application with heavy filling. It further exhibits good moldability due to its thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without impairing the past properties. Finally, it gives rise to a cured product which is not excessively hard, with a low elastic modulus, despite filling with an inorganic compound. The composition of the present invention includes components (A) to (B) listed below and is characterized by being fluid at 25° C. and free of solvent: (A) silicone-modified polyimide resin; (B) polymerizable compound; (C) polymerization initiator, (D) hydrophobic fumed silica; and (E) adhesion auxiliary agent.

The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance.

A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.

##STR00001##

The present invention provides a polyimide precursor that serves to produce a cured film that has high light permeability in combination with low birefringence and low linear thermal expansion. The polyimide precursor includes at least an acid dianhydride residue as represented by Formula (1), a diamine residue as represented by Formula (2), and one or more diamine residues as represented by Formula (3), the acid dianhydride residue as represented by Formula (1) accounting for 50 mol % or more of the total quantity of acid dianhydride residues in the polyimide precursor, the diamine residue as represented by Formula (2) accounting for 50 mol % or more of the total quantity of diamine residues in the polyimide precursor, and the diamine residue as represented by Formula (3) accounting for 15 mol % or less of the total quantity of diamine residues in the polyimide precursor.

The present application relates to a liquid crystal aligning agent, a liquid crystal alignment film and a method for producing the same, as well as a liquid crystal display device. The liquid crystal aligning agent comprises (i) a first polyamic acid having a photoreactive group without a liquid crystal group; (ii) a second polyamic acid having a liquid crystal group without a photoreactive group; (iii) a third polyamic acid having both a liquid crystal group and a photoreactive group; (iv) a fourth polyamic acid having neither a photoreactive group nor a liquid crystal group. The liquid crystal display device using the liquid crystal alignment film formed by the liquid crystal aligning agent provided by the present disclosure has a high display contrast and an improved AC residual image.

A liquid crystal photo-alignment agent includes a polyimide copolymer including a first structure unit represented by the described Chemical Formula 1 and a second structure unit represented by the described Chemical Formula 2, and, based on a 100 mole % sum total of the first structure unit and the second structure unit, the first structure unit is included in an amount of 70 to 95 mole % and the second structure unit is included in an amount of 5 to 30 mole %. A liquid crystal photo-alignment film may be manufactured using the same, and a liquid crystal display may include the liquid crystal photo-alignment film.

The present invention is a substrate for a display, the substrate having a film B including a polysiloxane resin on at least one surface of a film A including a polyimide resin, wherein the film B contains inorganic oxide particles therein, and the present invention has an object to provide a substrate for a display: being able to be applied to a color filter, an organic EL element, or the like without the need to carry out any complex operations; allowing high-definition displays to be manufactured; and being provided with a low CTE, a low birefringence, and flexibility.

A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): ##STR00001##
wherein δ represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R.sup.11 and R.sup.12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) ##STR00001##
wherein A.sup.1 and A.sup.3 are independently tetravalent moiety; A.sup.2 is a divalent moiety; n≥1; m≥1; R.sup.1 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, or C.sub.6-12 aryl; and R.sup.2 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, C.sub.6-12 aryl, or a reactive functional group.

The present invention relates to a flexible and transparent polyimide laminate and manufacturing method thereof. The flexible and transparent polyimide laminate comprises a conductive layer, an adhesive layer and a polyimide substrate. The conductive layer includes a plurality of metal nanowires, and is attached on the polyimide substrate by the adhesive layer. The adhesive layer is an insoluble polyimide film and is polymerized by aromatic dianhydride and one of the following monomer: alicyclic diamines, fluorine-containing diamines, and the combination thereof.

Objects of the present invention are: to obtain a polyimide that is excellent in heat resistance, transparency, and optical isotropy and is soluble in an organic solvent; to provide, by using either a polyimide or a polyamic acid which is a precursor or the polyimide, a product or a member that is highly required to have heat resistance and transparency; and particularly to provide a product and a member both of which are obtained by applying a polyamic acid solution and a polyimide solution of the present invention to the surface of an inorganic substance such as glass, metal, metal oxide, or a single crystal silicon. These objects can be attained by a polyimide acid and a polyimide which are each prepared from an alicyclic tetracarboxylic dianhydride and a monomer having a fluorene structure.