One of the objects of the present invention is to provide a fiber treatment agent consisting of an aqueous silicone dispersion capable of quickly forming a silicone elastomer coating having elongation and strength on room-temperature drying and to provide a coating which is the dry product. Further, the object of the present invention is to provide a coating on room-temperature drying without using a high activity catalyst such as organotin compounds. The present invention provides a fiber treatment agent comprising 100 parts by mass of (A) a silicone elastomer which is an addition-reaction product of the following component (A-1) with the following components (A-2) and (A-3): (A-1) an alkenyl group-containing organopolysiloxane having two or more alkenyl groups per molecule, (A-2) an organohydrogen polysiloxane having three or more hydrosilyl groups per molecule, (A-3) a linear diorganohydrogen polysiloxane having hydrosilyl groups only at both molecular chain terminals; 0.1 to 8 parts by mass of at least one surfactant selected from (B) anionic surfactants and (C) nonionic surfactants, 3 to 35 parts by mass of (D) colloidal silica, and 15 to 200 parts by mass of (E) water, relative to total 100 parts by mass of components (A) and (D).

A curable silicone adhesive composition comprising a combination of adhesion promoters is shown and described herein. The composition includes a first adhesion promoter selected from a silicon hydride adhesion promoter and a second adhesion promoter selected from an acrylate functional adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.

A curable silicone adhesive composition comprising a combination of adhesion promoters is shown and described herein. The composition includes a first adhesion promoter selected from a silicon hydride adhesion promoter and a second adhesion promoter selected from an acrylate functional adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.

A pressure sensitive adhesive (PSA) composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The PSA composition further comprises (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule. In addition, the PSA composition comprises (C) a hydrosilylation-reaction catalyst. The (A) silicate resin is miscible in the PSA composition in the absence of any solvent. The PSA composition can be at least partially cured to give a PSA.

A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically unsaturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically un saturated groups per molecule. The (A) silicate resin is miscible with the (B) organopolysiloxane in the absence of any solvent. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

A composition for forming a release coating is disclosed. The composition comprises (A) an organopolysiloxane comprising the reaction product of: (i) a silicone resin having a particular formula; and (ii) a cyclic siloxane; in the presence of a polymerization catalyst. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.

A curable organopolysiloxane composition that is one component, has superior storage stability, favorable curability and adhesion at relatively low temperatures, and an appropriate usable time is provided. In particular, the composition has excellent curability even at temperatures of 80° C. or lower and excellent adhesion to resins such as polyester and polyphenylene sulfide. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a hydrosilylation reaction catalyst; (D) a condensation reaction catalyst or a condensation reaction product thereof selected from the group consisting of tetra-tert-butoxy titanium, di(isopropoxy)bis(ethyl acetoacetate)titanium, and an aluminum chelate complex; and (E) a curing inhibitor. When cured, the composition provides a silicone rubber composition with a JIS A hardness of 5 or higher. The composition may include a large amount of (H) inorganic filler or the like.

A curable perfluoropolyether adhesive composition containing the following components (A) to (C): (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by —C.sub.aF.sub.2aO— in a main chain, “a” being an integer of 1 to 6; (B) an effective curing amount of an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; and (C) a catalytic amount of a hydrosilylation-reaction catalyst, where a cured product of the curable perfluoropolyether adhesive composition is an adhesive having adhesion of less than 0.5 N/25 mm.

One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.01 to 1 part by mass, wherein the thermally conductive filler (C) comprises magnesium oxide having a specific surface area of 0.4 m.sup.2/g or less in an amount of 20 to 50 wt % and aluminum hydroxide in an amount of 10 to 30 wt %, relative to a total weight of component (C).