A resist underlayer film-forming composition includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents a group represented by formula (2); a is an integer of 1 to 3; R.sup.1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; and b is an integer of 0 to 2; and a sum of a and b is no greater than 3. R.sup.2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; n is 1 or 2; R.sup.3 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; L represents a single bond or a divalent linking group; and * denotes a site bonding to the silicon atom in the formula (1). The composition is suitable for lithography with an electron beam or extreme ultraviolet ray.

##STR00001##

A resist underlayer film-forming composition includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents a group represented by formula (2); a is an integer of 1 to 3; R.sup.1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; and b is an integer of 0 to 2; and a sum of a and b is no greater than 3. R.sup.2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; n is 1 or 2; R.sup.3 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; L represents a single bond or a divalent linking group; and * denotes a site bonding to the silicon atom in the formula (1). The composition is suitable for lithography with an electron beam or extreme ultraviolet ray.

##STR00001##

The present invention pertains to a functionalized polymeric liquid polysiloxane material comprising non-organofunctional Q-type siloxane moieties and mono-organofunctional T-type siloxane moieties, as well as optionally tri-organofunctional M-type siloxane moieties and/or di-organofunctional D-type siloxane moieties characterized in that the polysiloxane material has a specified degree of polymerization, comprises a limited low amount of four-membered Q2-type and/or Q3-type siloxane ring species relative to the total Q-type siloxane species, and is functionalized at specific moieties. The present invention further pertains to methods for producing the polymeric liquid polysiloxane material as well as associated uses of the material.

Silicone polyoxamide and silicone polyoxamide-hydrazide copolymers comprise at least two repeating units of formula (I). In this formula, each R.sup.1 is independently an alkyl, haloalkyl, aralkyl, alkenyl, aryl, or aryl substituted with an alkyl, alkoxy, or halo; each Y is independently an alkylene, aralkylene, or a combination thereof; each G is independently a bond or a divalent residue equal to a diamine of formula R.sup.3HN-G-NHR.sup.3 minus the two —NHR.sup.3 groups; each R.sup.3 is independently hydrogen or alkyl or R.sup.3 taken together with G and with the nitrogen to which they are both attached form a heterocyclic group; each n is independently an integer of 0 to 300; each p is independently an integer of 1 to 25, and the average of p is 1.3 or greater; and each q is independently an integer of 1 to 2, and the average of q is no greater than 1.05.

##STR00001##

Silicone polyoxamide and silicone polyoxamide-hydrazide copolymers comprise at least two repeating units of formula (I). In this formula, each R.sup.1 is independently an alkyl, haloalkyl, aralkyl, alkenyl, aryl, or aryl substituted with an alkyl, alkoxy, or halo; each Y is independently an alkylene, aralkylene, or a combination thereof; each G is independently a bond or a divalent residue equal to a diamine of formula R.sup.3HN-G-NHR.sup.3 minus the two —NHR.sup.3 groups; each R.sup.3 is independently hydrogen or alkyl or R.sup.3 taken together with G and with the nitrogen to which they are both attached form a heterocyclic group; each n is independently an integer of 0 to 300; each p is independently an integer of 1 to 25, and the average of p is 1.3 or greater; and each q is independently an integer of 1 to 2, and the average of q is no greater than 1.05.

##STR00001##

An inorganic nanomaterial for continuous formaldehyde removal includes the following components in part by mass: 20-30 parts of water, 0.1-0.3 parts of cellulose, 0.1-0.2 parts of a defoamer, 0.3-0.6 parts of a dispersant, 0.3-0.6 parts of a wetting agent, 20-25 parts of titanium dioxide, 5-10 parts of kaolin, 10-15 parts of heavy calcium, 30-40 parts of modified inorganic hybrid resin, 0.1-1 part of a film-forming additive, and 0.1-1 part of propylene glycol. After inorganic hybrid modification, an ammonia group is introduced, which can continuously and effectively decompose formaldehyde in the environment. A coating film not only has good anti-mildew, anti-algae, fire prevention, and heat insulation functions, but also has a continuous formaldehyde removal function. The formaldehyde removal efficiency is greater than 95%. The durability of formaldehyde purification effect is 90%.

An object of the present invention is to provide a coating composition capable of forming a coating film which can maintain its appearance and gloss over a long period and which has high film hardness and high flexibility and exhibits excellent adhesion with respect to an epoxy resin anticorrosive coating film. An acrylic polysiloxane resin coating composition of the invention includes (A) a silicone resin, (B) a compound having one or more functional groups capable of undergoing Michael addition reaction with an unsaturated double bond in an acryloyloxy group, and having one or more alkoxy groups bonded to silicon, (C) a trifunctional or polyfunctional aliphatic urethane acrylate oligomer having a cyclic structure, and (D) a bifunctional acrylate monomer having no ether structures (except an ether structure in an acryloyloxy group) and no aromatic rings, the mass ratio of the total amount of (A) and (B) to the total amount of any acrylate oligomer(s) and any acrylate monomer(s) being 40:60 to 70:30.

An object of the present invention is to provide a coating composition capable of forming a coating film which can maintain its appearance and gloss over a long period and which has high film hardness and high flexibility and exhibits excellent adhesion with respect to an epoxy resin anticorrosive coating film. An acrylic polysiloxane resin coating composition of the invention includes (A) a silicone resin, (B) a compound having one or more functional groups capable of undergoing Michael addition reaction with an unsaturated double bond in an acryloyloxy group, and having one or more alkoxy groups bonded to silicon, (C) a trifunctional or polyfunctional aliphatic urethane acrylate oligomer having a cyclic structure, and (D) a bifunctional acrylate monomer having no ether structures (except an ether structure in an acryloyloxy group) and no aromatic rings, the mass ratio of the total amount of (A) and (B) to the total amount of any acrylate oligomer(s) and any acrylate monomer(s) being 40:60 to 70:30.

A siloxane polymer comprising polysiloxane, silphenylene, isocyanuric acid, and polyether skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the siloxane polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency and light resistance.

A composition crosslinkable by condensation reaction and producible using (A) organopolysiloxanes of the formula (R.sup.2O).sub.3-aSiR.sup.1.sub.aO(SiR.sub.2O).sub.nSiR.sup.1.sub.a(OR.sup.2).sub.3-a (I), (B1) silanes of the formula R.sup.3.sub.4-b(R.sup.4O).sub.bSi (II), and optionally (B2) silicon compounds consisting of units of the formula R.sup.7.sub.c(R.sup.8O).sub.dSiO.sub.(4-c-d)/2 (III). The composition contains organosilicon compounds having a molecular weight of less than or equal to 195 g/mol maximally in amounts of less than 0.5 wt%, based on organopolysiloxane (A).