Patent classifications
C08G8/04
HIGH-RIGIDITY RUBBER COMPOSITION
A rubber composition comprises at least one phenol/aldehyde resin based on at least one aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted, and at least one aromatic polyaldehyde selected from 1,3-benzenedicarboxaldehyde, 1,4-benzenedicarboxaldehyde and mixtures of these compounds.
HIGH-RIGIDITY RUBBER COMPOSITION
A rubber composition comprises at least one phenol/aldehyde resin based on at least one aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted, and at least one aromatic polyaldehyde selected from 1,3-benzenedicarboxaldehyde, 1,4-benzenedicarboxaldehyde and mixtures of these compounds.
METHOD FOR PRODUCING AN ABLATIVE RESIN
A method for producing an ablative resin by carrying out a reduction reaction for the reduction of a compound of formula A, followed by a polymerization reaction, formula A being the following:
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METHOD FOR PRODUCING AN ABLATIVE RESIN
A method for producing an ablative resin by carrying out a reduction reaction for the reduction of a compound of formula A, followed by a polymerization reaction, formula A being the following:
##STR00001##
Alkylphenol resins and a method of preparing thereof
Compositions, methods, and resins using alkyl aldehydes and phenols are provided herein. In one embodiment, a composition comprising an alkylphenol resin can be prepared by condensing at least one phenolic monomer selected from the group consisting of phenol, cresol, resorcinol, xylenol, ethyl phenol, alkylresorcinols, and combinations thereof; and at least one alkyl aldehyde having from 5 to 12 carbon atom alkyl groups. The alkylphenol resins of the application are free of octylphenol or nonylphenol monomers. In one embodiment, the alkylphenol resins may be prepared using formaldehyde, and alternatively, in another embodiment, the alkylphenol resins may be prepared without the use of formaldehyde. The process to make these new alternative alkylphenol resins is a cost effective process and easy to scale-up.
Alkylphenol resins and a method of preparing thereof
Compositions, methods, and resins using alkyl aldehydes and phenols are provided herein. In one embodiment, a composition comprising an alkylphenol resin can be prepared by condensing at least one phenolic monomer selected from the group consisting of phenol, cresol, resorcinol, xylenol, ethyl phenol, alkylresorcinols, and combinations thereof; and at least one alkyl aldehyde having from 5 to 12 carbon atom alkyl groups. The alkylphenol resins of the application are free of octylphenol or nonylphenol monomers. In one embodiment, the alkylphenol resins may be prepared using formaldehyde, and alternatively, in another embodiment, the alkylphenol resins may be prepared without the use of formaldehyde. The process to make these new alternative alkylphenol resins is a cost effective process and easy to scale-up.
Polymer, organic layer composition and method of forming patterns
A polymer, an organic layer composition including the polymer, and a method of forming a pattern using the organic layer composition, the polymer including a reaction product of a first compound represented by Chemical Formula 1 and a second compound represented by Chemical Formula 2:
(CHO).sub.n1—Ar.sup.1—X—Ar.sup.2—(CHO).sub.n2 [Chemical Formula 1] wherein, in Chemical Formula 1, X is O, S, or NR, in which R is a hydrogen, or a substituted or unsubstituted C1 to C30 alkyl group, Ar.sup.1 and Ar.sup.2 are independently a substituted or unsubstituted C6 to C30 aromatic ring group, and n1 and n2 are independently an integer of 1 to 3;
Ar.sup.3—(OH).sub.m [Chemical Formula 2] wherein, in Chemical Formula 2, Ar.sup.3 is a substituted or unsubstituted C10 to C30 fused aromatic ring group in which at least two rings are fused, and m is an integer of 1 to 3.
Polymer, organic layer composition and method of forming patterns
A polymer, an organic layer composition including the polymer, and a method of forming a pattern using the organic layer composition, the polymer including a reaction product of a first compound represented by Chemical Formula 1 and a second compound represented by Chemical Formula 2:
(CHO).sub.n1—Ar.sup.1—X—Ar.sup.2—(CHO).sub.n2 [Chemical Formula 1] wherein, in Chemical Formula 1, X is O, S, or NR, in which R is a hydrogen, or a substituted or unsubstituted C1 to C30 alkyl group, Ar.sup.1 and Ar.sup.2 are independently a substituted or unsubstituted C6 to C30 aromatic ring group, and n1 and n2 are independently an integer of 1 to 3;
Ar.sup.3—(OH).sub.m [Chemical Formula 2] wherein, in Chemical Formula 2, Ar.sup.3 is a substituted or unsubstituted C10 to C30 fused aromatic ring group in which at least two rings are fused, and m is an integer of 1 to 3.
LIGNIN-BASED PHENOLIC ADHESIVES, RELATED COMPOSITIONS, AND RELATED METHODS
The disclosure relates to adhesive compositions, including non-crosslinked resins and crosslinked/cured adhesives joining substrates, as well as related methods for making the compositions and articles. Compared to a conventional phenol (P) and formaldehyde (F) resin, the disclosed methods and compositions use lignin (L) and higher aldehydes (A) as corresponding replacements to provide an analog to a conventional PF resin with biobased reactants. Due to the differing reactivity of the LA components compared to the PF components, the initial condensation reaction between ortho-reactive sites in the lignin and the aldehyde is controlled to prevent gelation of the aqueous reaction mixture while reacting substantially all of the LA reactants to provide a non-crosslinked resin reaction product. The resin reaction product can then be cured at high temperature/high pressure conditions to provide a crosslinked adhesive, for example joining two substrates.
LIGNIN-BASED PHENOLIC ADHESIVES, RELATED COMPOSITIONS, AND RELATED METHODS
The disclosure relates to adhesive compositions, including non-crosslinked resins and crosslinked/cured adhesives joining substrates, as well as related methods for making the compositions and articles. Compared to a conventional phenol (P) and formaldehyde (F) resin, the disclosed methods and compositions use lignin (L) and higher aldehydes (A) as corresponding replacements to provide an analog to a conventional PF resin with biobased reactants. Due to the differing reactivity of the LA components compared to the PF components, the initial condensation reaction between ortho-reactive sites in the lignin and the aldehyde is controlled to prevent gelation of the aqueous reaction mixture while reacting substantially all of the LA reactants to provide a non-crosslinked resin reaction product. The resin reaction product can then be cured at high temperature/high pressure conditions to provide a crosslinked adhesive, for example joining two substrates.