Binders, methods for making same, and methods for making composite lignocellulose products therefrom. The binder can include about 30 wt % to about 40 wt % of solids that include a urea-modified aldehyde-based resin; about 0.1 wt % to about 3 wt % of solids that include an isocyanate-based resin; about 0.1 wt % to about 12 wt % of an extender; and about 50 wt % to about 62 wt % of water, where all weight percent values are based on a total weight of the binder. The binder can have a sodium hydroxide equivalent weight alkalinity of about 3 wt % to about 9 wt %.

Binders, methods for making same, and methods for making composite lignocellulose products therefrom. The binder can include about 30 wt % to about 40 wt % of solids that include a urea-modified aldehyde-based resin; about 0.1 wt % to about 3 wt % of solids that include an isocyanate-based resin; about 0.1 wt % to about 12 wt % of an extender; and about 50 wt % to about 62 wt % of water, where all weight percent values are based on a total weight of the binder. The binder can have a sodium hydroxide equivalent weight alkalinity of about 3 wt % to about 9 wt %.

A resist underlayer film-forming composition formed into a flat film which can exhibit high etching resistance, a good dry etching velocity ratio and a good optical constant, has a good covering property even against a so-called step-structure substrate, and has a small film thickness difference after being embedded. Also, a method for producing a polymer suitable for the resist underlayer film-forming composition; a resist underlayer film using the resist underlayer film-forming composition; and a method for manufacturing a semiconductor device. A resist underlayer film-forming composition containing a reaction product of an aromatic compound having 6 to 60 carbon atoms with a carbonyl group in a cyclic carbonyl compound having 3 to 60 carbon atoms and a solvent, wherein the reaction product has such a structure that one of the carbon atoms in the cyclic carbonyl compound links two molecules of the aromatic compound to each other.

A resist underlayer film-forming composition formed into a flat film which can exhibit high etching resistance, a good dry etching velocity ratio and a good optical constant, has a good covering property even against a so-called step-structure substrate, and has a small film thickness difference after being embedded. Also, a method for producing a polymer suitable for the resist underlayer film-forming composition; a resist underlayer film using the resist underlayer film-forming composition; and a method for manufacturing a semiconductor device. A resist underlayer film-forming composition containing a reaction product of an aromatic compound having 6 to 60 carbon atoms with a carbonyl group in a cyclic carbonyl compound having 3 to 60 carbon atoms and a solvent, wherein the reaction product has such a structure that one of the carbon atoms in the cyclic carbonyl compound links two molecules of the aromatic compound to each other.

Binders, methods for making same, and methods for making composite lignocellulose products therefrom. The binder can include about 30 wt % to about 40 wt % of solids that include a urea-modified aldehyde-based resin; about 0.1 wt % to about 3 wt % of solids that include an isocyanate-based resin; about 0.1 wt % to about 12 wt % of an extender; and about 50 wt % to about 62 wt % of water, where all weight percent values are based on a total weight of the binder. The binder can have a sodium hydroxide equivalent weight alkalinity of about 3 wt % to about 9 wt %.

Binders, methods for making same, and methods for making composite lignocellulose products therefrom. The binder can include about 30 wt % to about 40 wt % of solids that include a urea-modified aldehyde-based resin; about 0.1 wt % to about 3 wt % of solids that include an isocyanate-based resin; about 0.1 wt % to about 12 wt % of an extender; and about 50 wt % to about 62 wt % of water, where all weight percent values are based on a total weight of the binder. The binder can have a sodium hydroxide equivalent weight alkalinity of about 3 wt % to about 9 wt %.

A resist underlayer film-forming composition formed into a flat film which can exhibit high etching resistance, a good dry etching velocity ratio and a good optical constant, has a good covering property even against a so-called step-structure substrate, and has a small film thickness difference after being embedded. Also, a method for producing a polymer suitable for the resist underlayer film-forming composition; a resist underlayer film using the resist underlayer film-forming composition; and a method for manufacturing a semiconductor device. A resist underlayer film-forming composition containing a reaction product of an aromatic compound having 6 to 60 carbon atoms with a carbonyl group in a cyclic carbonyl compound having 3 to 60 carbon atoms and a solvent, wherein the reaction product has such a structure that one of the carbon atoms in the cyclic carbonyl compound links two molecules of the aromatic compound to each other.

A resist underlayer film-forming composition formed into a flat film which can exhibit high etching resistance, a good dry etching velocity ratio and a good optical constant, has a good covering property even against a so-called step-structure substrate, and has a small film thickness difference after being embedded. Also, a method for producing a polymer suitable for the resist underlayer film-forming composition; a resist underlayer film using the resist underlayer film-forming composition; and a method for manufacturing a semiconductor device. A resist underlayer film-forming composition containing a reaction product of an aromatic compound having 6 to 60 carbon atoms with a carbonyl group in a cyclic carbonyl compound having 3 to 60 carbon atoms and a solvent, wherein the reaction product has such a structure that one of the carbon atoms in the cyclic carbonyl compound links two molecules of the aromatic compound to each other.

This invention relates to a resin preparable by reaction of a phenol/formaldehyde novolak with tetraethyl orthosilicate in a mass ratio above 28:1, wherein the phenol of the phenol/formaldehyde novolak is substituted or unsubstituted hydroxybenzene or a mixture of two or more such phenols, and to a particulate material coated with said resin. Said particles can be used e.g. in the shell molding process for the production of shell molds and shell cores; and as proppants for use in the hydraulic fracturing process.

This invention relates to a resin preparable by reaction of a phenol/formaldehyde novolak with tetraethyl orthosilicate in a mass ratio above 28:1, wherein the phenol of the phenol/formaldehyde novolak is substituted or unsubstituted hydroxybenzene or a mixture of two or more such phenols, and to a particulate material coated with said resin. Said particles can be used e.g. in the shell molding process for the production of shell molds and shell cores; and as proppants for use in the hydraulic fracturing process.