C08G8/32

Run flat tire
09834043 · 2017-12-05 · ·

A run flat tire having a side reinforcing rubber part is disclosed. The side reinforcing rubber part is formed by a rubber composition having a ratio (M50H/M50N) of tensile stress (M50H) in 50% elongation at a measurement temperature of 100° C. to tensile stress (M50N) in 50% elongation at a measurement temperature of 23° C. of from 1.0 to 1.3. A cushion rubber layer interposed between the side reinforcing rubber part and a bead filler is provided, and tensile stress in 50% elongation at a measurement temperature of 23° C. of a rubber composition forming the cushion rubber layer is larger than tensile stress in 50% elongation at a measurement temperature of 23° C. of the rubber composition forming the side reinforcing rubber part, and is smaller than tensile stress in 50% elongation at a measurement temperature of 23° C. of a rubber composition forming the bead filler.

HMF-based phenol formaldehyde resin

A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula ##STR00001##
In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted groups including H, halide, C.sub.1-C.sub.20 alkyl group, C.sub.1-C.sub.20 alkenyl group, C.sub.1-C.sub.20 cycloalkyl group, C.sub.1-C.sub.20 cycloalkenyl group, homocyclic aromatic group or heterocyclic aromatic group.

HMF-based phenol formaldehyde resin

A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula ##STR00001##
In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted groups including H, halide, C.sub.1-C.sub.20 alkyl group, C.sub.1-C.sub.20 alkenyl group, C.sub.1-C.sub.20 cycloalkyl group, C.sub.1-C.sub.20 cycloalkenyl group, homocyclic aromatic group or heterocyclic aromatic group.

IN-SITU ALKYLPHENOL-ALDEHYDE RESINS

The invention relates to an in-situ process for preparing an alkylphenol-aldehyde resin. The process comprises the step of providing a raw alkylphenol composition. The raw alkylphenol composition comprises one or more alkylphenol compounds and at least about 1 wt % phenol. Each alkylphenol compound has one or more alkyl substituents. The raw alkylphenol composition is reacted directly, without pre-purification, with one or more aldehydes to form an in-situ alkylphenol-aldehyde resin. The invention also relates to an in-situ alkylphenol-aldehyde resin formed from the in-situ process, and its use in a tackifier composition and rubber composition. The tackifier composition and rubber composition containing the in-situ alkylphenol-aldehyde resin show, inter alia, improved tack performance.

IN-SITU ALKYLPHENOL-ALDEHYDE RESINS

The invention relates to an in-situ process for preparing an alkylphenol-aldehyde resin. The process comprises the step of providing a raw alkylphenol composition. The raw alkylphenol composition comprises one or more alkylphenol compounds and at least about 1 wt % phenol. Each alkylphenol compound has one or more alkyl substituents. The raw alkylphenol composition is reacted directly, without pre-purification, with one or more aldehydes to form an in-situ alkylphenol-aldehyde resin. The invention also relates to an in-situ alkylphenol-aldehyde resin formed from the in-situ process, and its use in a tackifier composition and rubber composition. The tackifier composition and rubber composition containing the in-situ alkylphenol-aldehyde resin show, inter alia, improved tack performance.

MODIFIED ARYLHYDROXY COMPOUNDS FOR THE PRODUCTION OF POLYURETHANE OR POLYISOCYANURATE

Esterified arylhydroxy compounds for the production of polyurethane or polyisocyanurate. In order to provide aromatic polyols for the production of polyurethanes or polyisocyanurates which are process-technically suitable in terms of their viscosity and at the same time give the end product good physical properties and a good reaction to fire, esterified arylhydroxy compounds are proposed as polyols.

MODIFIED ARYLHYDROXY COMPOUNDS FOR THE PRODUCTION OF POLYURETHANE OR POLYISOCYANURATE

Esterified arylhydroxy compounds for the production of polyurethane or polyisocyanurate. In order to provide aromatic polyols for the production of polyurethanes or polyisocyanurates which are process-technically suitable in terms of their viscosity and at the same time give the end product good physical properties and a good reaction to fire, esterified arylhydroxy compounds are proposed as polyols.

ESTER COMPOUND AND RESIN COMPOSITION
20230242705 · 2023-08-03 · ·

Compounds including two or more aromatic rings to which a fluorine-substituted arylcarbonyloxy group is directly bonded are useful as epoxy resin curing agents.

Compound having alkoxysilyl group and active ester group, method for preparing same, composition comprising same, and use

The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.

UNDERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM, AND PATTERN FORMATION METHOD

An object of the present invention is to provide a resist underlayer film forming composition for lithography that has features of having excellent smoothing performance on an uneven substrate, good embedding performance into a fine hole pattern, and a smoothed wafer surface after film formation, and the like. The object can be achieved by an underlayer film forming composition for lithography containing a compound having a protecting group.