C08G8/36

METHODS FOR ENHANCING THE BONDING STRENGTH OF THERMOSET ADHESIVES AND SEALANTS VIA DISULFIDE DYNAMIC CHEMISTRY
20230227702 · 2023-07-20 ·

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.

Rigid Polyurethane Based Foam with Compression Strength and Fire Resistance

Described herein is a method for the preparation of a rigid polyisocyanate based foam, including mixing (a) polyisocyanate, (b) at least one compound having at least two hydrogen atoms reactive towards isocyanates, (c) optionally flame retardant, (d) blowing agent, (e) catalyst and (f) optionally further additives, to form a reaction mixture and reacting the reaction mixture to obtain the polyurethane based rigid foam where the compound reactive towards isocyanates (b) includes an aromatic polyetherpolyol (b2) and at least one compound selected from the group consisting of an aromatic polyesterpolyol (b1) and a polyetherpolyol (b3) different from polyether (b2). Also described herein is a rigid polyisocyanate based foam obtained from such a method and a polyol component for the production of a polyisocyanate based foam.

Polycondensate based water-reducer

The present invention relates to polycondensates containing at least a structural unit, which is an aromatic moiety bearing a polyether side chain, at least a structural unit, which is an aromatic moiety bearing at least one phosphoric acid monoester group, at least a structural unit, which is an aromatic moiety, bearing at least one hydroxy group and at least a methylene unit (—CH.sub.2—), which is attached to two aromatic structural units. The invention also concerns a process for the production of the polycondensates, their use for the dispersion of inorganic binders, for increasing the strength development of concrete and for improving the slump-retention of concrete. The invention relates also to building material mixtures comprising the polycondensates and inorganic binders.

Polycondensate based water-reducer

The present invention relates to polycondensates containing at least a structural unit, which is an aromatic moiety bearing a polyether side chain, at least a structural unit, which is an aromatic moiety bearing at least one phosphoric acid monoester group, at least a structural unit, which is an aromatic moiety, bearing at least one hydroxy group and at least a methylene unit (—CH.sub.2—), which is attached to two aromatic structural units. The invention also concerns a process for the production of the polycondensates, their use for the dispersion of inorganic binders, for increasing the strength development of concrete and for improving the slump-retention of concrete. The invention relates also to building material mixtures comprising the polycondensates and inorganic binders.

Binder based on phenolic resins of the benzyl ether type, containing free phenol and free hydroxybenzyl alcohols

The invention relates to a binder based on phenolic resins of the benzyl ether type and isocyanate compounds having at least two isocyanate groups, containing free phenol and free hydroxybenzyl alcohols in the polyol component. The invention further relates to mold material mixtures containing the binder and to cores, molds, or risers produced with the mold material mixtures and to the use thereof in metal casting.

RESIST UNDERLAYER FILM-FORMING COMPOSITION

A composition for forming a resist underlayer film exhibits strong etching resistance, has a good dry etching rate ratio and a good optical constant, and is capable of forming a film that provides good coverage over a so-called multilevel substrate and that is flat with reduced difference in thickness after embedding. A resist underlayer film uses said composition for forming a resist underlayer film; and a method for producing a semiconductor device. The composition for forming a resist underlayer film contains: a polymer having the partial structure represented by formula (1); and a solvent. (In the formula, Ar represents an optionally substituted C6-20 aromatic group.)

Demulsification additive composition, use thereof, and method of demulsification

The present invention relates to a demulsification additive composition for demulsification of water-in-oil emulsion caused due to wash water in the crude oil, wherein the composition comprises: (a) one or more demulsifiers (the component (a)); and (b) a compound selected from the group comprising glyoxal, neutralized glyoxal, glyoxal derivative and a mixture thereof (the component (b)), and (c) further comprises phosphoric acid (the component (c)). The present invention also relates to a method of using the present demulsification additive composition for demulsification of water-in-oil emulsion caused due to wash water in the crude oil. The present invention also relates to a method for demulsification of water-in-oil emulsion caused due to wash water in the crude oil by employing the present demulsification additive composition.

POLYPHENOLIC CONDENSATES AND EPOXY RESINS THEREOF

Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

NANOIMPRINT LITHOGRAPHY ADHESION LAYER
20170335150 · 2017-11-23 ·

A compound of Formula A-1:

##STR00001##

where n is an integer and R is C.sub.1-10 alkyl. In some cases, n is an integer of 1 to 20 or 5 to 15. R may be substituted or unsubstituted. An adhesive composition may include a compound of Formula A-1. The adhesive composition may include at least one of a crosslinker, a catalyst, and a solvent. An imprint lithography stack may include a substrate and an adhesion layer adhered to the substrate, where the adhesion layer includes a compound of Formula A-1. Forming an adhesion layer on an imprint lithography substrate includes disposing an adhesive composition on the imprint lithography substrate and polymerizing the adhesive composition to yield the adhesion layer on the substrate, where the adhesive composition includes a compound of Formula A-1, where n is an integer and R is C.sub.1-10 alkyl.

Modified hydroxy naphthalene novolak resin, production method for modified hydroxy naphthalene novolak resin, photosensitive composition, resist material and coating
09765175 · 2017-09-19 · ·

Provided is a modified hydroxy naphthalene novolak resin which is optimal for a photosensitive composition and a resist material having high optical sensitivity, resolution, and alkali developability, and excellent heat resistance and moisture absorption resistance, and the modified hydroxy naphthalene novolak resin includes a structural moiety (I) represented by Structural Formula as a repeating unit: ##STR00001## wherein R.sup.1is any one of a hydrogen atom, a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group; m is 1 or 2; R.sup.2's each independently is any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, and a halogen atom; and at least one of the R.sup.1's present in the resin is any one of a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group.