A resin composition having favorable heat stability while capable of primary curing at 140° C or lower, and having excellent heat resistance after curing, and a pre-preg having excellent heat resistance while a molded product after molding maintains mechanical characteristics are provided. The resin composition of the present invention comprises a constituent element (A): a cyanate ester resin, a constituent element (B): an imidazole compound, and a constituent element (C): silica, in which an average particle size of the silica is 0.4 μm or less. The pre-preg of the present invention comprises carbon fibers, and the resin composition of the present invention.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

This disclosure provides for processes to form a porous crosslinked polyphenoxide resin, using a templating process which can increase the porosity, pore size, active sites, and the like of the resin, as compared with a non-templated crosslinked polyphenoxide resin. The process includes contacting a phenol or polyphenol compound with formaldehyde and an aqueous base in the presence of a basic particulate template to form a templated crosslinked polyphenol resin. The templated crosslinked polyphenol resin can then be contacted with an aqueous acid to remove the basic particulate template and form a porous crosslinked polyphenol resin. This porous crosslinked polyphenol resin can subsequently be contacted with a metal-containing base to form a promoter for acrylate and acrylic acid formation from CO.sub.2 and ethylene coupling.

A method of reducing the formaldehyde emission of a mineral fiber product bonded with a urea-modified phenol-formaldehyde resol resin-type binder comprises adding dextrose to the binder composition during and/or after preparation of the binder composition but before curing of the binder composition applied to the mineral fibers.

Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.

The embodiments relate to a polymerisable thermoset composition having improved flame retardant properties, a polymerised thermoset having improved flame retardant properties, a process for manufacturing the polymerised thermoset, and use of the polymerisable thermoset composition to produce lightweight construction components, preferably carbon fibre composites (CFRP), and a lightweight construction component, preferably carbon fibre composite (CFRP), containing the polymerised thermoset.

This disclosure provides for synthetic routes of acrylic acid and other ?,?-unsaturated carboxylic acids and their salts, including catalytic methods. For example, there is provided a process for producing an ?,?-unsaturated carboxylic acid or its salt, comprising: (1) contacting in any order, a group 8-11 transition metal precursor, an olefin, carbon dioxide, a diluent, and a porous crosslinked polyphenoxide resin comprising associated metal cations to provide a mixture; and (2) applying reaction conditions to the mixture suitable to produce the ?,?-unsaturated carboxylic acid or a salt thereof. Methods of regenerating the polyphenoxide resin comprising associated metal cations are described.

Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).