Patent classifications
C08J2425/10
Halogen-free resin composition and uses thereof
Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.
Thermosetting resin composition, prepreg, laminate, and printed circuit board
A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.
GREASE-RESISTANT FILM, GREASE-RESISTANT BASE MATERIAL, AND GREASE-RESISTANT PAPER
An oil-resistant film may be provided by an oil-resistant base material that is excellent in the oil resistance even in not only a plane part but also a bent part of a package can be obtained and also to the provision of an oil-resistant base material having the oil-resistant film and an oil-resistant paper having the oil-resistant film. An oil-resistant film may contain a polyvinyl alcohol-based polymer (A) and a polymer particle (B) containing a polymer having a glass transition temperature of 40° C. or lower, wherein the content of the polymer particle (B) is 1 part by mass or more and less than 150 parts by mass based on 100 parts by mass of the polyvinyl alcohol-based polymer (A); and an oil-resistant base material (oil-resistant paper) having the oil-resistant film on a base material (paper).
Resin composition and article made therefrom
A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.
rABS/PBT/ASG composite material and preparation method thereof
A rABS/PBT/ASG composite material and a preparation method thereof utilize the characteristics of rABS with carboxyl and hydroxyl groups, wherein rABS are pre-blended with ASG to increase the viscosity, so that the epoxy groups on the ASG molecules react with the hydroxyl groups and the carboxyl groups on the rABS, and the acrylonitrile-styrene segments in ASG and rABS are thermodynamically miscible, followed by reacting and blending with PBT to prepare the rABS/PBT/ASG composite material. ASG acts as a chain extender and solubilizer in the mixture. The mixture prepared in this way have good compatibility, and the tensile strength, impact strength and elongation at break of the composite material are comprehensively improved. The composite material obtained has the advantages of both ABS and PBT materials, which has broad application prospects in the field of ABS plastic recycling.
rABS/PBT/ASG Composite Material and Preparation Method Thereof
A rABS/PBT/ASG composite material and a preparation method thereof utilize the characteristics of rABS with carboxyl and hydroxyl groups, wherein rABS are pre-blended with ASG to increase the viscosity, so that the epoxy groups on the ASG molecules react with the hydroxyl groups and the carboxyl groups on the rABS, and the acrylonitrile-styrene segments in ASG and rABS are thermodynamically miscible, followed by reacting and blending with PBT to prepare the rABS/PBT/ASG composite material. ASG acts as a chain extender and solubilizer in the mixture. The mixture prepared in this way have good compatibility, and the tensile strength, impact strength and elongation at break of the composite material are comprehensively improved. The composite material obtained has the advantages of both ABS and PBT materials, which has broad application prospects in the field of ABS plastic recycling.
Skin-foam-substrate structure via induction heating
A method of forming a skin-foam-substrate type structure particular suitable as an automobile trim component. The method comprises supplying a polymer resin containing a chemical foaming agent and including metal particles capable of inductive heating, that is positioned between a polymeric skin and substrate, followed by inductive heating to cause foaming of the polymeric resin. The foamed polymer resin adheres to the skin and substrate.
Pellet and thermoplastic resin composition
Provided is a carbon black master batch pellet for black coloring comprising a high concentration of carbon black, having an excellent dispersibility of the carbon black, and which can express a stable black coloring concentration with hardly any classification occurring even when mixed in the various raw materials of a thermoplastic resin composition. A pellet comprising 35 to 55 mass % of carbon black (A), 65 to 45 mass % of a thermoplastic resin (B), and 0 to 10 mass % of a dispersant assistant (C), wherein a diameter (D) in a direction orthogonal to the axial direction is 2 to 5 mm, and a ratio (D/L) of the diameter (D) to a length (L (mm)) in the axial direction is 3.0 to 1.5.
MODIFIED DIENE-CONTAINING (CO)POLYMER, METHOD FOR PREPARING THEREOF AND USE AS A FLAME RETARDANT
Disclosed herein are modified diene-containing (co)polymers, in particular, modified styrene-butadiene copolymer, which can be used as flame retardants for expandable polystyrene polymer compositions. In particular, disclosed is a modified diene-containing (co)polymer, a method for preparing it, and use as a flame retardant for expandable polystyrene. The modified diene-containing (co)polymer claimed in the invention is characterized by high thermostability, namely, a 5% weight loss temperature of at least 180° C., a molecular weight of at least 1500 g/mol and a halogen content of at least 35 wt. %; the content of tertiary and/or allyl halogenides is in the range from 0 to less than 1.5 wt. %, and also does not affect the polymerization process and the formation of polystyrene granules either, and allows to obtain polystyrene granules with a yellowness index of 2 to 6 units, comparable to the yellowness index of polystyrene granules containing HBCD (from 0 to 3 units).
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.