A foamed polymer composition includes a matrix polymer component, and from 0.01 wt % to 2 wt %, based on the weight of the polymer composition, of a nanostructured fluoropolymer, a nanostructured fluoropolymer encapsulated by an encapsulating polymer, or a combination thereof. The matrix polymer component includes polybutylene terephthalate (PBT), polyetherimide (PEI), polyethylene terephthalate (PET), polycarbonate (PC), poly(p-phenylene oxide) (PPO), polystyrene (PS), polyphenylene sulfide (PPS), polypropylene (PP), polyamide (PA), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), polybutylene naphthalate (PBN), copolymers thereof, or a combination thereof. Methods for forming foamed polymer compositions, including core-back molding methods and extrusion foaming methods, are also described.

Expandable chlorinated vinyl chloride-based resin particles from which a chlorinated vinyl chloride-based resin foamed molded product achieving both high expansion ratio and excellent surface appearance are provided. The expandable chlorinated vinyl chloride-based resin particles have a porosity of not more than 5.5 (ml/100 g).

The invention relates to a composite component that has improved bonding properties and includes a substrate (i) made of a thermoplastic polymer blend composition, and a coating (ii); in a layer located 5 to 10 μm below the boundary surface between the substrate (i) and the coating (ii), the substrate (i) has a dispersed, non-lamellar phase structure. The invention also relates to a method for manufacturing the composite component.

A novel material for producing auxetic foams is disclosed. The material comprises a multiphase, multicomponent polymer foam with a filler polymer having a carefully selected glass transition temperature. Novel methods for producing auxetic foams from the material are also disclosed that consistently, reliably and quickly produce auxetic polyurethane foam at about room temperature (25° C.). This technology overcomes challenging issues in the large-scale production of auxetic PU foams, such as unfavorable heat-transmission problem and harmful organic solvents.

Processes for producing filled polyol compositions, such as polymer polyol compositions. The processes include reacting a polymerizable composition in the presence of a composition comprising a base polyol and an amine antioxidant, in which the amine antioxidant comprises a secondary diarylamine, a primary aromatic amide, a triazole, or a combination thereof.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##

Filled polyol compositions that include a dispersion of polymer particles in a base polyol, in which the filled polyol composition further includes a triazole antioxidant. Methods for producing such filled polyol compositions are also described, as well as use of such filled polyol compositions in the production of polyurethane foams.

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion. ##STR00001##

A method for producing a polyamide resin composition containing a crystalline polyamide resin (A) containing a polycaproamide resin as a main component, a semi-aromatic amorphous polyamide resin (B), an inorganic reinforcing material (C), a master batch of carbon black (D), and a copper compound (E); a dispersion liquid of the copper compound (E) has a concentration of 0.04% by mass to 1.0% by mass; and the crystalline polyamide resin (A) containing a polycaproamide resin as a main component, the semi-aromatic amorphous polyamide resin (B), the master batch of carbon black (D), and the dispersion liquid of the copper compound (E) are mixed in advance, followed by charging the mixture is into a hopper part of an extruder, and charging the inorganic reinforcing material (C) into the extruder by a side feed method.