Patent classifications
C08J2425/16
Photonic crystal structure and anti-forgery color conversion film comprising same
An anti-forgery color conversion film includes a photonic crystal structure whose color is converted by an external stimulus such as a breath. The photonic crystal structure includes a first refractive index layer including a first polymer exhibiting a first refractive index; and a second refractive index layer which is alternately laminated with the first refractive index layer and includes a second polymer exhibiting a second refractive index. A consumer who purchases an article including the color conversion film may easily distinguish the authenticity of the article.
RESIN COMPOSITION, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD EACH OBTAINED USING SAID RESIN COMPOSITION
An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).
PHOTONIC CRYSTAL STRUCTURE AND ANTI-FORGERY COLOR CONVERSION FILM COMPRISING SAME
An anti-forgery color conversion film includes a photonic crystal structure whose color is converted by an external stimulus such as a breath. The photonic crystal structure includes a first refractive index layer including a first polymer exhibiting a first refractive index; and a second refractive index layer which is alternately laminated with the first refractive index layer and includes a second polymer exhibiting a second refractive index. A consumer who purchases an article including the color conversion film may easily distinguish the authenticity of the article.
Thermoplastic resin composition, method of preparing the same, and molded part including the same
A thermoplastic resin composition with low gloss and improved colorability, pencil hardness and wear resistance has (A) 5 to 35% by weight of a first graft copolymer having an average particle diameter of 50 to 150 nm and containing acrylate rubber as a core; (B) 10 to 40% by weight of a second graft copolymer having an average particle diameter of more than 150 nm and 800 nm or less and containing acrylate rubber as a core; (C) 5 to 15% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer having a weight average molecular weight of 70,000 to 130,000 g/mol; (D) 20 to 50% by weight of an aromatic vinyl compound-(meth)acrylate compound copolymer having a weight average molecular weight of 65,000 to 100,000 g/mol; and (E) 0.1 to 7% by weight of a syndiotactic polystyrene resin.
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED PART INCLUDING THE SAME
A thermoplastic resin composition with low gloss and improved colorability, pencil hardness and wear resistance has (A) 5 to 35% by weight of a first graft copolymer having an average particle diameter of 50 to 150 nm and containing acrylate rubber as a core; (B) 10 to 40% by weight of a second graft copolymer having an average particle diameter of more than 150 nm and 800 nm or less and containing acrylate rubber as a core; (C) 5 to 15% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer having a weight average molecular weight of 70,000 to 130,000 g/mol; (D) 20 to 50% by weight of an aromatic vinyl compound-(meth)acrylate compound copolymer having a weight average molecular weight of 65,000 to 100,000 g/mol; and (E) 0.1 to 7% by weight of a syndiotactic polystyrene resin.
STYRENE COPOLYMER MOLDING COMPOSITIONS WITH REDUCED MOLD DEPOSIT FORMATION FOR HIGH GLOSS APPLICATIONS
The invention relates to a thermoplastic molding composition (P) comprising: (A) 81.1 to 99.7 wt. -% of at thermoplastic polymer composition (A) comprising: (A-1) graft copolymer (A-1), and (A-2) thermoplastic matrix (A-2) based on vinylaromatic copolymers; (B) at least one hindered amine light stabilizing composition (B) comprising: (B-1) 0.2 to 0.9 wt.-%, of at least one hindered amine light stabilizer having a dipiperidine structure with at least one alkyl group at each of the 2 and 6 positions of the dipiperidine structure and (B-2) 0.1 to 0.9 wt.-%, of a hindered amine light stabilizer mixture having a monopiperidine structure with at least one alkyl group at each of the 2 and 6 positions of the monopiperidine structure and (B-3) 0 to 2 wt.-%, of at least one hindered amine light stabilizer having a polymeric structure comprising piperidine groups with at least one alkyl group at each of the 2 and 6 positions of the piperidine groups, (C) 0 to 10 wt.-%, of colorants, dyes and/or pigments (C); and (D) 0 to 5 wt.-%, of further additives (D) different from (B) and (C); provided that the thermoplastic molding composition (P) further comprises 0.001 wt.-% to 0.1 wt.-%, based on the total weight of the molding composition (P), of oligomers and/or polymers comprising ethylene and/or propylene repeating units or provided that the thermoplastic molding composition (P) further comprises 0 wt.-%, based on the total weight of the molding composition (P), of oligomers and/or polymers comprising ethylene and/or propylene repeating units (as component E), wherein the constituents (A) to (E) sum up to 100 wt.-% of the molding composition (P).
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).
RESIN COMPOSITION, INSULATING RESIN FILM AND USE THEREOF
Resin composition, insulating resin film and use thereof. The resin composition comprises the following components in parts by mass: 50-90 parts of a hydrogenated hydrocarbon resin and 10-50 parts of a benzocyclobutene resin; the benzocyclobutene resin comprises at least one structural unit A and at least one structural unit B. The hydrogenated hydrocarbon resin and the benzocyclobutene resin with a specific structure are both total-hydrocarbon structures, having low dielectric constant Dk, dielectric loss tangent Df, and water absorption rate. The benzocyclobutene resin can be thermally cured to obtain the high cross-linking density, high glass transition temperature, and excellent heat resistance. The resin composition and the insulating resin film prepared therewith have ultra-low dielectric constant and loss tangent, excellent dielectric properties, heat resistance, damp heat resistance, adhesion strength, and excellent mechanical properties such as flexibility, satisfying the performance requirements of electronic components being high frequency, high speed, and high integration.
Product with absorbed gel
A product with absorbed gel leaving the exposed surface of such product free of stickiness and/or free of the release of oils in any appreciable amounts.
Polyolefin interpenetrated network material for hydrocarbon recovery
Interpenetrated polyolefin network for use in recovering or containing hydrocarbons such as hydrocarbons contained in oil, are disclosed. Advantageously, the interpenetrated polyolefin networks absorb the hydrocarbon, including viscous hydrocarbons and crude oils, to form a gel that can be collected and processed by heat to release the collected hydrocarbons.