The present invention relates to a polymer composition comprising a (meth)acrylic polymer and a multistage polymer. In particular the present invention it relates to polymer composition comprising a (meth)acrylic polymer and a multistage polymer that can be used as a masterbatch. More particularly the present invention relates also to a process for preparing a polymer composition comprising a (meth)acrylic polymer and a multistage polymer by spray drying or coagulation.

The present invention relates to a thermoplastic resin composition and a molded article manufactured thereofrom. In accordance with the present invention, a thermoplastic resin composition providing higher chemical resistance with respect to a blowing agent while providing the same impact strength, gloss, and vacuum moldability as existing resin compositions when used to produce an inner case of a refrigerator, and a molded article manufactured from the same are provided.

The invention relates to a composite component that has improved bonding properties and includes a substrate (i) made of a thermoplastic polymer blend composition, and a coating (ii); in a layer located 5 to 10 μm below the boundary surface between the substrate (i) and the coating (ii), the substrate (i) has a dispersed, non-lamellar phase structure. The invention also relates to a method for manufacturing the composite component.

The present invention belongs to the field of active polymer materials. Specifically, it relates to an active polystyrene film that has antimicrobial or antioxidant activity and the method of production of said film. It also refers to wrappers, packages and slice separators (interleavers) that comprise said film.

The invention relates to a thermoplastic molding composition comprising 5.0 to 57 wt.-% ABS graft copolymer (A); 30.5 to 80 wt.-% SAN copolymer (B) 1.5 to 9.5 wt.-% copolymer (C) with epoxy, maleic anhydride or maleic imide functions; 5 to 29 wt.-% of hollow glass microspheres (D); 6 to 12 wt.-% of glass fibers (E); 0 to 5 wt.-% additives and/or processing aids (F), having a low density and high strength, and a process for its preparation, shaped arti-cles thereof, and its use in the electronics sector.

The present invention relates to a polymer composition comprising an epoxy resin and a multistage polymer. In particular the present invention it relates to polymer composition comprising an epoxy resin and a multistage polymer that can be used as a masterbatch. More particularly the present invention relates also to a process for preparing a polymer composition comprising an epoxy resin and a multistage polymer by spray drying or coagulation.

An aromatic vinyl copolymer is a polymer of a reaction mixture including: an aromatic vinyl compound; a vinyl cyanide compound; a silicone compound having at least two unsaturated reactive groups; and a C.sub.4 to C.sub.20 linear or branched alkyl group-containing acrylic compound. A thermoplastic resin composition including the aromatic vinyl copolymer can have excellent matting properties, impact resistance, flowability, and balance therebetween.

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

The present invention provides: a curable composition including an epoxy resin, an amine compound, and core-shell particles, in which the amine compound contains an N-(aminoalkyl)piperazine compound as an essential component; a cured product thereof; a fiber reinforced composite material, a fiber reinforced resin molded article, and a method for producing a fiber reinforced resin molded article. The curable resin composition has fast curability, also has favorable impregnation property into reinforced fibers, and furthermore, can form a cured product having excellent toughness and the like.

The purpose of the present invention is to provide an epoxy resin composition which exhibits a high level of deforming capacity and fracture toughness and from which a resin cured product maintaining heat resistance can be obtained. The epoxy resin composition according to the present invention satisfies condition 1 or condition 2 below, wherein the resin cured product obtained by reacting the epoxy resin composition at 150° C. for 60 minutes has a tensile elongation at break of 7% or more. Condition 1: including all the following components [A], [B], and [C], component [A]: a bifunctional aliphatic epoxy resin having a specific structure, component [B]: a terminal carboxy-modified acrylic rubber, and component [C]: a dicyandiamide. Condition 2: including the following components [D], [E], and [F] and satisfying conditions [a] and [b] below, component [D]: core-shell type rubber particles, component [E]: a boric ester compound, component [F]: a curing agent, condition [a]: including 9-18 parts by mass of component [D] with respect to 100 parts by mass of the total epoxy resin, and condition [b]: 0.003≤(the content of component [E]/the content of component [D])≤0.05.