Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

A soft magnetic resin composition contains flat soft magnetic particles, and a resin component containing an epoxy resin, a phenol resin, and an acrylic resin. The epoxy resin consists of only an epoxy resin having three or more functional groups, the phenol resin consists of only a phenol resin having three or more functional groups, and the content ratio of the acrylic resin in the resin component is 25 mass % or more.

The invention relates to a composition for the production of foams based on phenolic resin, use thereof, and a process for the production of the composition. For provision of a composition for the production of foams based on phenolic resin, where the said composition delivers improved reaction to fire with, in essence, no alteration of further important foam properties, it is proposed that the composition comprises an alkoxylated novolak, wherein the novolak is produced using phenol, cresol and/or xylenol.

A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

A soft magnetic resin composition contains flat soft magnetic particles, and a resin component containing an epoxy resin, a phenol resin, and an acrylic resin. The epoxy resin consists of only an epoxy resin having three or more functional groups, the phenol resin consists of only a phenol resin having three or more functional groups, and the content ratio of the acrylic resin in the resin component is 25 mass % or more.

The invention relates to a composition for the production of foams based on phenolic resin, use thereof, and a process for the production of the composition. For provision of a composition for the production of foams based on phenolic resin, where the said composition delivers improved reaction to fire with, in essence, no alteration of further important foam properties, it is proposed that the composition comprises an alkoxylated novolak, wherein the novolak is produced using phenol, cresol and/or xylenol.

A resin composition contains: a thermosetting resin; a thermally conductive filler; and mica; in which, when the thermally conductive filler is divided into a filler group (A) having a particle diameter of from 10 m to 100 m, a filler group (B) having a particle diameter of from 1.0 m to smaller than 10 m, and a filler group (C) having a particle diameter of from 0.1 m to smaller than 1.0 m, a ratio of the filler group (C) with regard to the thermally conductive filler, based on volume, is larger than a ratio of the filler group (B) with regard to the thermally conductive filler, based on volume.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).