Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

The present invention relates to a molding made of expanded bead foam, wherein at least one fiber (F) is partly within the molding, i.e. is surrounded by the expanded bead foam. The two ends of the respective fibers (F) that are not surrounded by the expanded bead foam thus each project from one side of the corresponding molding. The present invention further provides a panel comprising at least one such molding and at least one further layer (S1). The present invention further provides processes for producing the moldings of the invention from expanded bead foam or the panels of the invention and for the use thereof, for example as rotor blade in wind turbines.

A curable composition includes an olefin-aromatic vinyl compound-aromatic polyene copolymer satisfying conditions (1) to (4) and an additive resin, which is at least one of a hydrocarbon-based elastomer, polyphenylene ether, olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer, and aromatic polyene-based resin. (1) The number average molecular weight of the copolymer is 5000 to 100000. (2) The aromatic vinyl compound monomer has 8 to 20 carbon atoms, and the content of the unit of the monomer is 0 to 70 mass %. (3) The aromatic polyene is selected from polyenes having 5 to 20 carbon atoms and a plurality of vinyl and/or vinylene groups in the molecule, and the content of the groups is 1.5 to 20 pieces per number average molecular weight. (4) The olefin is selected from olefins having 2 to 20 carbon atoms, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.

A thermosetting resin material, a prepreg, and a metal substrate are provided. The thermosetting resin material includes a resin composition and inorganic fillers. The resin composition includes: 10 wt % to 30 wt % of a polyphenylene ether resin, 40 wt % to 60 wt % of a cyanate resin, and 20 wt % to 40 wt % of a bismaleimide resin. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

A reinforced flame retardant composition comprising: 30-80 wt % of a polymer component comprising 25-65 wt % of a poly(alkylene terephthalate); 5-25 wt % of a poly(phenylene ether); optionally, 5-35 wt % of a polyamide; 5-30 wt % of a reinforcing mineral filler, preferably talc, 5-35 wt % of glass fibers; 4-25 wt % of a flame retardant component comprising: a metal di(C.sub.1-6alkyl)phosphinate and an auxiliary flame retardant; 0.01-2 wt % of a compatibilizing agent; 5-15 wt % of an impact modifier; wherein a molded sample of the composition has a UL94 rating of V0 at thicknesses of 1.5 mm and lower; and a comparative tracking index of 250-399 volts, preferably 400-599 volts, more preferably 600 volts or greater as determined in accordance with UL 746A, a mean time of arc resistance of at least 120 seconds as determined according to ASTM D495, or a combination thereof.

The present invention provides a radome substrate and a preparation method thereof. The radome substrate includes: 5 to 10 parts of polyphenylene ether resin, 70 to 85 parts of ceramic masterbatch, 10 to 15 parts of hollow microbead masterbatch, 1 to 3 parts of a compatibilizer, and 0.1 to 0.3 parts of a lubricant. The radome substrate prepared according to the method provided in the present invention has a high dielectric constant and stress cracking resistance performance.

A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

A novel material for producing auxetic foams is disclosed. The material comprises a multiphase, multicomponent polymer foam with a filler polymer having a carefully selected glass transition temperature. Novel methods for producing auxetic foams from the material are also disclosed that consistently, reliably and quickly produce auxetic polyurethane foam at about room temperature (25° C.). This technology overcomes challenging issues in the large-scale production of auxetic PU foams, such as unfavorable heat-transmission problem and harmful organic solvents.

The present invention discloses a multilayer composite rubber-plastic foam insulation material and a preparation method thereof. The composite rubber-plastic foam insulation material includes a two-layer structure; the two-layer structure includes an insulation layer and a first functional layer; the insulation layer and the first functional layer are both made of a rubber-plastic foam material; the first functional layer and the insulation layer are integrally molded by blending extrusion and vulcanization foaming, and the first functional layer and the insulation layer form an integral structure. The multilayer composite rubber-plastic foam insulation material provided by the present invention adopts a vulcanization foaming integral molding process, and not only ensures the thermal insulation property of the insulation layer, but also gives the functional layer corresponding functions by selecting different functional polymers, thereby satisfying a variety of personalized needs in engineering applications.