The present disclosure relates to a prepreg, a preparation method thereof and a fiber-reinforced composite material prepared therefrom. The preparation method of a prepreg may include an aramid fiber base material with improved wettability to resin, can increase a thickness reduction rate during molding of the prepreg, has an appropriate resin content, and can provide a prepreg suitable for molding by an out-of-autoclave process. In addition, the prepreg may provide a fiber-reinforced composite material that exhibits a thin thickness and a high resin content even by an out-of-autoclave process, and shows high strength and low moisture absorption

Provided is a curable composition that is soluble in various solvents (organic solvents other than highly toxic organic solvents, for example, cyclohexanone) while maintaining excellent low dielectric properties, wherein a film obtained by curing the curable composition has excellent mechanical properties. A curable composition, comprising: a polyphenylene ether having a functional group including an unsaturated carbon bond, which is obtained from raw material phenols including phenols satisfying at least condition 1 (having a hydrogen atom at an ortho position and a para position), and having a slope calculated by a conformation plot of less than 0.6; and at least one of a compound containing at least one maleimide group in one molecule, a triazine-based compound containing at least one thiol group, and crosslinked polystyrene particles.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications, has high Tg, and is excellent in elastic modulus and strength. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (2): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or less, (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less.

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

To provide a novel material that maintains suppleness which is the advantage of a material using fibers and has a low thermal shrinkage ratio, and a method for producing the material, a partially welded material using the material, a composite material, and a method for producing a molded product. A material including: a first region, a fiber region, and a second region continuously in a thickness direction; the first region and the second region being each independently a resin layer including from 20 to 100 mass % of a thermoplastic resin component and from 80 to 0 mass % of reinforcing fibers; the fiber region including from 20 to 100 mass % of thermoplastic resin fibers and from 80 to 0 mass % of reinforcing fibers; the thermoplastic resin component included in the first region and the thermoplastic resin component included in the second region each independently having a crystallization energy during temperature increase of 2 J/g or greater, measured by differential scanning calorimetry; and the thermoplastic resin fibers included in the fiber region having a crystallization energy during temperature increase of less than 1 J/g, measured by differential scanning calorimetry; wherein the crystallization energy during temperature increase is a value measured by using a differential scanning calorimeter (DSC) in a nitrogen stream while heating is performed from 25° C. to a temperature that is 20° C. higher than a melting point of the thermoplastic resin component or the thermoplastic resin fibers at a temperature increase rate of 10° C./min.

The present invention relates to the field of a protection system based on composite material used in ballistics. The application relates to a two-steps light and heat curable resin composition, a process of forming in a first step a prepreg using said resin and in a second step a protection system comprising the laminated composite of the invention.

An FRP molded product formed by impregnating a fiber base material with a matrix resin using a flow medium, wherein the flow medium has a sheet shape and comprises fibers made of a phenoxy resin, the matrix resin is an epoxy resin, the fiber base material and the flow medium are stacked, at least part of the flow medium is hardened in a state where the part of the flow medium is integrated with the matrix resin by dissolution or adhesion, and the hardened flow medium becomes a design face.

A Z-pin for increasing a delamination resistance of continuous fibre-reinforced polymer composites, formed of a composite material including a polymer matrix, and a plurality of fibres embedded in the polymer matrix and aligned along the length direction of Z-pin, the fibres having an elongation at break of at least 2% and a tensile strength of at least 5 GPa, the polymer matrix having an elongation at break equal to or greater than the elongation at break of the fibres, and a tensile strength of at least 120 MPa.

A reinforced element for use in the construction and assembly of an industrial textile, the element comprising a fibrous reinforcing material encapsulated by a thermoplastic polymer matrix, wherein: the thermoplastic polymer matrix comprises an amorphous polyester, a low-crystallinity polyester, polyphenylene sulphide (PPS), or a mixture thereof; the fibrous reinforcing material comprises continuous filaments selected from the group consisting of thermoplastic polymeric filaments, thermosetting polymeric filaments, glass fibers and a mixture thereof such that a majority of the continuous filaments are oriented in a first direction and the remainder of the continuous filaments are oriented in a second direction that is generally perpendicular to the first direction; a temperature at which the amorphous polymer substantially enters a liquid state, or the melting point of the low-crystallinity polyester, is at least 10° C. less than the melting point of the thermoplastic polymeric filaments; and the polymer matrix and the fibrous reinforcing material are both substantially transparent to radiant laser energy in a range of from about 800 nm to about 1200 run.

An epoxy resin composition for a fiber-reinforced composite material includes: (a) one or more epoxy resins; (b) an aromatic diamine compound; (c) a dicyandiamide; (d) a urea compound; and (e) an amine adduct compound, blended in specific ranges.