In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

The invention relates to a pre-impregnated fibre-reinforced composite material in laminar form, obtained impregnating a fibrous mass with a polymeric binder composition and intended to be subjected to successive forming and complete curing operations to produce a fibre-reinforced composite material. The polymeric binder composition comprises one or more resins chosen in the group consisting of siloxane resins and silsesquioxane resins, and can optionally comprise one or more organic resins. The polymeric binder composition appears as a liquid with viscosity between 55000 and 10000 mPas at temperatures between 50° C. and 70° C. The polymeric binder composition forms a polymeric binder matrix, not cross-linked or only partially cross-linked, that fills the interstices of the fibrous mass. The invention also relates to a method for making said pre-impregnated fibre-reinforced composite material in laminar form. The invention also relates to a manufactured article obtained by hot forming and complete curing of the aforesaid pre-impregnated fibre-reinforced composite material, as well as a method for making said manufactured article.

The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

Systems and methods are provided for fabrication of enhanced carbon fiber laminates that utilize encapsulated catalyst. One embodiment is a method that includes acquiring a batch of dry fibers, and acquiring a batch of catalyst capsules that each comprise catalyst that accelerates polymerization of monomers of a resin, and a shell that encapsulates the catalyst and liquefies at a curing temperature. The method further includes interspersing the catalyst capsules among the dry fibers, and impregnating the fibers with the resin after interspersing the catalyst capsules with the fibers.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

An epoxy resin composition comprises the following components [A] to [E]: [A] epoxy resin, [B] amine-type curing agent, [C] cure accelerator, and [D] red phosphorus. The epoxy resin composition contains, per 100 mass parts for the total amount of [A], 25-45 mass parts of [A1] a liquid bisphenolic epoxy resin and 20-40 mass parts of [A2] a phenol novolac-type epoxy resin, and has a content ratio of [E] to [D] ([E]/[D]) of at least 1. Provided are a light-weight fiber-reinforced composite material that exhibits an excellent flame retardancy and mechanical properties and does not produce halogen gas during combustion, and an epoxy resin composition that has a viscosity suitable for obtaining the fiber-reinforced composite material as well as prepregs.

An impregnation liquid is provided, which includes (A) phenolic resin, (B) diazonaphthoquinone-based compound or a derivative thereof, (C) ionic compound, and (D) organic solvent. The weight of (A) phenolic resin and the weight of (B) diazonaphthoquinone-based compound or a derivative thereof have a ratio of 0.2:0.8 to 0.9:0.1, and the weight of (C) ionic compound and the total weight of (A) phenolic resin and (B) diazonaphthoquinone-based compound or a derivative thereof have a ratio of 0.2:1 to 1.4:1. The impregnation liquid can be used to form an activated carbon layer to wrap and to be directly in contact with the surface of a mesh.

The present invention relates to a phosphazene compound containing an ester group having a structure of formula (I). The present invention grafts ester groups to phosphazene compounds and makes terminal grafted hydroxyl and carboxyl groups reacted with polymer matrix, producing an improvement of flame retardancy and a reduction of dielectric constant at the same time when the phosphazene compound is introduced into polymer matrix. Since N and P atoms are directly bonded into the polymer matrix by a reaction rather than addition and combination means in the prior art, there is no reduced mechanical properties of the matrix due to the addition of flame retardants.

The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by general formula (1):

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wherein a plurality of R each independently represent any of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.

A radical-polymerizable resin composition comprising one or more metal-containing compounds (A) selected from a metal soap (A1) and a β-diketone skeleton-containing metal complex (A2); one or more thiol compounds (B) selected from a secondary thiol compound (B1) and a tertiary thiol compound (B2); and a radical-polymerizable compound (C) can stably cure under a dry condition, in water and in seawater and further on a wet substrate. The radical-polymerizable resin composition is useful as a repairing material for inorganic structure, a radical-polymerizable coating composition, a concrete spall preventing curable material, a reinforcing fiber-containing composite material, etc.