Compounded copolyamide powders, processes for preparation of compounded copolyamide powders, articles made therefrom and uses.

Compounded copolyamide powders, processes for preparation of compounded copolyamide powders, articles made therefrom and uses.

A flexible sheet of positive temperature coefficient (PTC) material formed of a polymer resin and a conductive filler, the sheet of PTC material having a thickness in a range of 10 μm to 100 μm. A method for forming the flexible sheet of positive temperature coefficient material may include preparing a PTC ink from a polymer resin, a conductive filler, and a solvent, applying the PTC ink to a substrate, pulling a blade over the PTC ink to create a uniformly thick layer of the PTC ink on the substrate, and allowing the PTC ink to dry so that the solvent evaporates and leaves a solid layer of PTC material on the substrate.

A flexible sheet of positive temperature coefficient (PTC) material formed of a polymer resin and a conductive filler, the sheet of PTC material having a thickness in a range of 10 μm to 100 μm. A method for forming the flexible sheet of positive temperature coefficient material may include preparing a PTC ink from a polymer resin, a conductive filler, and a solvent, applying the PTC ink to a substrate, pulling a blade over the PTC ink to create a uniformly thick layer of the PTC ink on the substrate, and allowing the PTC ink to dry so that the solvent evaporates and leaves a solid layer of PTC material on the substrate.

Compositions useful for making additive manufactured articles are comprised of a styrenic thermoplastic elastomer, the styrenic thermoplastic elastomer being comprised of a block copolymer being comprised of at least two blocks of a vinyl aromatic monomer and at least one block of a conjugated diene monomer, and a solid particulate filler dispersed therein, wherein the filler has a surface area of 0.05 m.sup.2/g to 120 m.sup.2/g. The compositions may be formed into filaments for use in fused filament fabrication additive manufacturing. The filaments display good printability without drying or storage under dry conditions.

A conductive two-dimensional particle of a layered material comprising one layer or one layer and plural layers, wherein the layer includes a layer body represented by: M.sub.mX.sub.n, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom; and a monovalent metal ion, wherein the conductive two-dimensional particle does not contain an amine, a total content of chlorine and bromine in the conductive two-dimensional particle is 1,500 ppm by mass or less, and an average value of a major diameter of a two-dimensional surface of the conductive two-dimensional particle is 1.0 μm to 20 μm.

A conductive two-dimensional particle of a layered material comprising one layer or one layer and plural layers, wherein the layer includes a layer body represented by: M.sub.mX.sub.n, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom; and a monovalent metal ion, wherein the conductive two-dimensional particle does not contain an amine, a total content of chlorine and bromine in the conductive two-dimensional particle is 1,500 ppm by mass or less, and an average value of a major diameter of a two-dimensional surface of the conductive two-dimensional particle is 1.0 μm to 20 μm.

Compositions and devices comprising MXene materials, suitable for use as selective and/or tunable infrared emitters and/or absorbers, and methods of making coatings with low thermal emissivities using coatings comprising MXene materials.

Polysilocarb formulations, cured and pyrolized materials, was well as articles and use for this material. In particular pyrolized polysilocarb ceramic materials and articles contain these materials where, the ceramic has from about 30 weight % to about 60 weight % silicon, from about 5 weight % to about 40 weight % oxygen, and from about 3 weight % to about 35 weight % carbon, and wherein 20 weight % to 80 weight % of the carbon is silicon-bound-carbon and 80 weight % to about 20 weight % of the carbon is free carbon.

Polysilocarb formulations, cured and pyrolized materials, was well as articles and use for this material. In particular pyrolized polysilocarb ceramic materials and articles contain these materials where, the ceramic has from about 30 weight % to about 60 weight % silicon, from about 5 weight % to about 40 weight % oxygen, and from about 3 weight % to about 35 weight % carbon, and wherein 20 weight % to 80 weight % of the carbon is silicon-bound-carbon and 80 weight % to about 20 weight % of the carbon is free carbon.