C08K5/357

Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

Composite materials containing benzoxazines and method for making the same

A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

Composite materials containing benzoxazines and method for making the same

A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

Biologically-inspired compositions that enable visible through infrared color changing compositions

Biologically-inspired compositions, including color changing compositions, and corresponding embodiments such as sensors, textile materials, coatings and films, are provided which typically include a solid, transparent and nondegradable matrix. The matrix contains a plurality of (i) synthetic particles having a size in the micrometer or nanometer range, each synthetic particle including one or more aggregates of a pigment selected from phenoxazone, phenoxazine, and a derivate or precursor thereof, and a stabilizing material which has a refractive index larger than 1.45, the aggregates having a size larger than about 100 nm; or (ii) submicrometer natural particles extracted and purified from homogenized tissue.

Biologically-inspired compositions that enable visible through infrared color changing compositions

Biologically-inspired compositions, including color changing compositions, and corresponding embodiments such as sensors, textile materials, coatings and films, are provided which typically include a solid, transparent and nondegradable matrix. The matrix contains a plurality of (i) synthetic particles having a size in the micrometer or nanometer range, each synthetic particle including one or more aggregates of a pigment selected from phenoxazone, phenoxazine, and a derivate or precursor thereof, and a stabilizing material which has a refractive index larger than 1.45, the aggregates having a size larger than about 100 nm; or (ii) submicrometer natural particles extracted and purified from homogenized tissue.

Dielectric for high density substrate interconnects

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

STABILIZER COMPOSITIONS AND METHODS FOR USING SAME FOR PROTECTING POLYMERIC ORGANIC MATERIALS FROM UV LIGHT AND THERMAL DEGRADATION

Stabilizer compositions having a stabilizing amount of at least one co-active agent; an ultraviolet light absorber chosen from an ortho-hydroxy benzophenone, and/or an ortho-hydroxyphenyl benzotriazole; and a hindered amine light stabilizer, are provided herein, along with masterbatch concentrates containing same, and processes for using same for stabilizing polymeric organic materials to protect against light and thermal degradation due to exposure to UV irradiation.